From Integrated Circuit Packaging, Assembly and Interconnections

Microelectronics Glossary

A

ACTIVE CIRCUIT AREA
All areas on the die from outside edge of the bond pads inward.
ACTIVE DEVICE
An electronic device, a bare die or a packaged component a diode, transistor or integrated circuit.
ADHESION
The sticking together of two different materials.
ALLOY
A solution of two or more metals.
ALUMINA
Aluminum oxide (AI 2O 3). Ceramic substrates used in microelectronic applications are made of formulations that are primarily (92%, 96% and 99%+) alumina.
AMBIENT
The temperature and/or pressure and/or humidity of the atmosphere surrounding a device.
ANISOTROPIC
Single directional material property, as opposed to isotropic with material properties the same in all directions. For example, an anisotropic conductive adhesive is conductive in the z-direction only.
ANNEALING
Slow heating and/or cooling of a material to relieve stresses and thereby stabilize the material properties.
ANODIZING
An electro-chemical process for oxidizing metals, most often aluminum.
APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC)
A custom designed, not off the shelf, IC intended for a distinct application.
AREA ARRAY
Refers to the configuration of the I/O pads on a device or package. Pads are arranged in an x-y grid format with pins, solder balls or columns for attachment.
ARTWORK
The circuit pattern, typically a drawing at 10X, from which screens or photomasks can be fabricated using photographic reduction.
ASSEMBLY
The attachment of components, ...
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