OOPS (OUT OF PRODUCTION SPARES) PROGRAM
Obsolete and End Of Life (EOL) Replacement Program
for semiconductor, Integrated Circuit (IC) , TRANSFORMER and board/module/box
GM SYSTEMS can provide a variety of alternative approaches to resolve your Obsolete or End of Life (EOL) scenarios. Our team has over a 100 years of experience with IC DESIGN AND FABRICATION,BOARD, MODULE, and SYSTEMS level solutions for COMMERCIAL, INDUSTRIAL and MILITARY/AEROSPACE products.
We can provide consulting services, use your die bank, or offer full turnkey solutions.
A few CASE STUDIES
Please fill out the "CONTACT US" form below.)
for semiconductor, Integrated Circuit (IC) , TRANSFORMER and board/module/box
GM SYSTEMS can provide a variety of alternative approaches to resolve your Obsolete or End of Life (EOL) scenarios. Our team has over a 100 years of experience with IC DESIGN AND FABRICATION,BOARD, MODULE, and SYSTEMS level solutions for COMMERCIAL, INDUSTRIAL and MILITARY/AEROSPACE products.
We can provide consulting services, use your die bank, or offer full turnkey solutions.
- Direct replacement or Re-use of old parts (salvaged, mil-strip, and re-assembled)
- Die bank replacement and traceability to original semiconductor manufacturers lot number.
- Replacement with similar part or with adapter or interposer
- Alternative manufacture's standard part (with or without spec. relief)
- Alternative parts substitution
- Full Redesign into Custom Integrated Circuit, hybrid or MCM package to emulate original chip function
- Complete IC redesign into Bipolar, GaAs, CMOS ASIC, or FPGA
- Complete board re-design.
- Commercial, Military, or Space screening and qualifications available.
- METAL TO (Transistor Outline) , Plastic DIP, SOT, SOIC, SOP, QFN, QFP, BGA, ceramic, hybrid or MCM packages (see Table I below for a short list of packages supported. (For other package styles, please fill out the "CONTACT US" form below.)
A few CASE STUDIES
- A MIL-STD-1553/mil-STD-1760 special transformer which was obsolete by the original manufacturer was created FC1760TI (Click here for data sheet)
- A inductive proximity sensor obsolete by Electro-Honeywell 4943 (Click here)
- Supported the update and repair of an Four Sided Street Clock where the original manufacturer went bankrupt and was damaged by lighting and set at 4:30 for two years (Click to see picture)
- Arranged for packaging of devices when a IC supplier did not want to support a plastic DIP package (Click to see picture)
Please fill out the "CONTACT US" form below.)
TABLE I Plastic Package Portfolio (SHORT LIST)
| Product Name/Package Style | Lead Count |
|---|---|
| PLASTIC DUAL IN LINE PACKAGE (PDIP) | 8L, 14L, 16L, 18L, 20L,24L (0.300” BODY SIZE) 22L, 30L (0.400” BODY SIZE) 24L, 28L, 40L (0.600” BODY SIZE) |
| SMALL OUTLINE PACKAGE (SOP) | 8L, 14L, 16L (0.150” BODY SIZE) / Epad version available 16L (0.220” BODY SIZE) 16L, 18L, 20L, 24L, 28L (0.300” BODY SIZE) |
| POWER SMALL OUTLINE PACKAGE (PSOP) | 8L (0.150” BODY SIZE) |
| MINI SMALL OUTLINE PACKAGE (MSOP) | 8L, 10L (0.118” BODY SIZE) | TRANSISTOR OUTLINE | 2L, 3L (TO-92 STANDARD PKG) 3L (TO-92 FLAT PKG) |
| SMALL OUTLINE TRANSISTOR | 3L, 5L, 6L (SOT-23) 3L (SOT-89) 4L (SOT-143) 3L (SOT-323) |
| SMALL OUTLINE DIODE | 2L (SOD-323) |
