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OOPS (OUT OF PRODUCTION SPARES) PROGRAM

Obsolete and End Of Life (EOL) Replacement Program
for  semiconductor, Integrated Circuit (IC) , TRANSFORMER and board/module/box 

GM SYSTEMS can provide a variety of alternative approaches to resolve your Obsolete or End of Life (EOL) scenarios. Our team has over a 100 years of experience with IC DESIGN AND FABRICATION,BOARD, MODULE, and SYSTEMS level solutions for COMMERCIAL, INDUSTRIAL  and MILITARY/AEROSPACE  products.
We can provide consulting services, use your die bank, or offer full turnkey solutions.
  • Direct replacement or Re-use of old parts (salvaged, mil-strip, and re-assembled)
  • Die bank replacement and traceability to original semiconductor manufacturers lot number.
  • Replacement with similar part or with adapter or interposer
  • Alternative manufacture's standard part (with or without spec. relief)
  • Alternative parts substitution
  • Full Redesign into Custom Integrated Circuit, hybrid or MCM package to emulate original chip function
  • Complete IC redesign into Bipolar, GaAs, CMOS ASIC, or FPGA
  • Complete board re-design.
  • Commercial, Military, or Space screening and qualifications available.
  • METAL TO (Transistor Outline) , Plastic DIP, SOT, SOIC, SOP, QFN, QFP, BGA, ceramic, hybrid or MCM packages (see Table I below for a short list of packages supported. (For other  package styles,  please fill out the "CONTACT US" form below.)
WE CAN SECOND SOURCE YOUR PROBLEM TRANSFORMER OR RECREATE OBSOLETE TRANSFORMERS WHERE THE MANUFACTURER IS NO LONGER IN BUSINESS or the product line is shelved

A few CASE STUDIES
  • ​ A MIL-STD-1553/mil-STD-1760 special transformer which was obsolete by the original manufacturer  was created FC1760TI (Click here for data sheet)
  • A inductive proximity sensor obsolete by Electro-Honeywell 4943 (Click here)
  • Supported the update and repair of an Four Sided Street Clock where the original manufacturer went bankrupt and was damaged by lighting and set at 4:30 for two years (Click to see picture)
  • Arranged for packaging of devices when a IC supplier did not want to support a plastic DIP package (Click to see picture)

​Please fill out the "CONTACT US" form below.)

TABLE I Plastic Package Portfolio (SHORT LIST)

Product Name/Package Style Lead Count
PLASTIC DUAL IN LINE PACKAGE (PDIP) 8L, 14L, 16L, 18L, 20L,24L (0.300” BODY SIZE)
22L, 30L (0.400” BODY SIZE)
24L, 28L, 40L (0.600” BODY SIZE)
SMALL OUTLINE PACKAGE (SOP) 8L, 14L, 16L (0.150” BODY SIZE) / Epad version available
16L (0.220” BODY SIZE)
16L, 18L, 20L, 24L, 28L (0.300” BODY SIZE)
POWER SMALL OUTLINE PACKAGE (PSOP) 8L (0.150” BODY SIZE)
MINI SMALL OUTLINE PACKAGE (MSOP) 8L, 10L (0.118” BODY SIZE)
TRANSISTOR OUTLINE 2L, 3L (TO-92 STANDARD PKG)
3L (TO-92 FLAT PKG)
SMALL OUTLINE TRANSISTOR 3L, 5L, 6L (SOT-23)
3L (SOT-89)
4L (SOT-143)
3L (SOT-323)
SMALL OUTLINE DIODE 2L (SOD-323)
CLICK FOR TYPICAL QFN PACKAGES

    CONTACT US AT:

    PLEASE LIST NAME AND LOCATION OF COMPANY
    PLEASE REVIEW THE URGENCY OF YOUR REQUEST
    PLEASE LIST THE NATURE OF YOUR INQUIRY AND ANY OTHER CONTACT INFORMATION. (TIME AVAILABLE AND DATE)
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