"RF & MICROWAVE ELECTRONIC PACKAGING FOR MILITARY, AEROSPACE AND HIGH RELIABILITY APPLICATIONS" BY TOM TERLIZZI

3/30/2020

INTRODUCTION
RF and Microwave circuit assembly, packaging and test require key attention to detail to achieve reliable operations in extreme military and aerospace environments. Design issues, component sourcing, substrate selection, process selections and material trade offs, are critical due to their high frequency characteristics. In addition new semiconductor device technology transitioning from commercial market (COTS) such as GaN on silicon substrates, GaN on Silicon Carbide (SiC), Silicon germanium (SiGe) and Indium Phosphide (InP) are now available for high reliability applications.. from TAP TIMES APRIL, 2020 EDITION
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1/13/2022 02:01:20 am

Due to its high frequency characteristics, design challenges, component sourcing, substrate selection, process decisions, and material trade-offs are crucial.

Authors

Principal author is Tom Terlizzi VP at GM Systems a Management and Technology consulting firm, providing Business & Strategic plans, Acquisitions, Marketing & Sales strategy, Product development for electronics, microelectronic and proposal support. Various guest author on technology, sales, management and manufacturing topics are also presented. Additional topics political or special interest in nature may be added

"RF & MICROWAVE ELECTRONIC PACKAGING FOR MILITARY, AEROSPACE AND HIGH RELIABILITY APPLICATIONS" BY TOM TERLIZZI

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