PRESS RELEASES 2024-2021
PRESS RELEASES 2024
OCTOBER 10 - CISSIOD OFFERS LTB (Last Time Buy) for HIGH TEMPERATURE SEMICONDUCTOR DEVICES
CISSIOD OFFERS LTB (Last Time Buy) for HIGH TEMPERATURE SEMICONDUCTOR DEVICES Our wafer fab foundry X-FAB recently notified us that they will discontinue the XI10 process by March 2025. This process has been running for many years and is now getting replaced by more recent technologies. As you may know, most of the CISSOID High Temperature products, rated up to 175°C or 225°C, are using X-FAB’s XI10 process. This decision is creating a major disruption of our supply chain as there is no equivalent on the market to the XI10 process.
Dear Customer,
You will find attached an urgent letter containing important, time sensitive information. If you are not the correct person, please pass on to someone authorised to take action.
In this letter, Cissoid is announcing the discontinuation of its High Temperature line of products. It contains the full list of affected parts and the time limits to receive orders.
We would appreciate if you could confirm good reception of the letter.
Wishing you a good reception,
Best regards,
Emmanuel Poli
VP Sales
Mobile : +33676314935
www.cissoid.com
click here for PDF
Dear Customer,
You will find attached an urgent letter containing important, time sensitive information. If you are not the correct person, please pass on to someone authorised to take action.
In this letter, Cissoid is announcing the discontinuation of its High Temperature line of products. It contains the full list of affected parts and the time limits to receive orders.
We would appreciate if you could confirm good reception of the letter.
Wishing you a good reception,
Best regards,
Emmanuel Poli
VP Sales
Mobile : +33676314935
www.cissoid.com
click here for PDF
OCTOBER 1 - GM SYSTEMS TO EXHIBIT AT THE IEEE NORTH JERSEY SECTION MTT-Society & AP-Society Joint Chapters PRESENTS 38th ANNUAL SYMPOSIUM AND MINI-SHOW WEDNESDAY, OCTOBER 9, 2024 Hanover Manor, 16 Eagle Rock Ave., East Hanover, NJ 07936.
CLICK HERE FOR LIST OF PRESENTATION AND MORE SEE DETAILS BELOW.
Thank you again for your support and we are excited to see you on Wednesday OCTOBER 9. 2024!
ALL ARE WELCOME (IEEE Membership not required). REGISTRATION IS ON-SITE
THERE IS NO CHARGE TO ATTEND THE SYMPOSIUM OR SHOW.
COMPLIMENTARY BREAKFAST / LUNCH INCLUDED FOR ALL.
GM SYSTEMS WILL BE HIGHLIGHTING:
AGILE MICROWAVE TECHNOLOGY-RF/MICROWAVE LNA & POWER AMPS AND MULTI-FUNCTION RF & MICROWAVE MODULE
CIRTEK-RF, MILLIMETER WAVE, MICROWAVE ASSEMBLY LOW COST-(OFF SHORE PHILIPPINES) AND PLASTIC PKG.
ES COMPONENTS-DIE, SMT AND PACKAGED PART DISTRIBUTOR-VISHAY HIGH FREQUENCY & MIL-PRF-123 MLCC CAPS, THICK & THIN FILM RESISTORS, & SUBSTRATES, Siliconix JFET, MOSFETs and INTEGRATED CIRCUITS AND MANY OTHERS CLICK FOR LINE CARD
MICROCHIP -WIRELESS AND MICROWAVE MMIC PRODUCTS -DIE AND PACKAGED PARTS, (MICREL, ATMEL, MICROSEMI, SiTIme, VPT COMPONENTS,,SENSITRON,SEMICOA, GOODARK, ZETEX, SEMIKRON
MICROCOAT –EPOXIES AND UV MATERIALS and high temperature adhesives, UV exposure equipment AND TECHCON ADHESIVE DISPENSING EQUIPMENT
TJ GREEN ASSOCIATES -CONSULTING IN RF DESIGN AND PACKAGING -SEMINARS
Thank you again for your support and we are excited to see you on Wednesday OCTOBER 9. 2024!
ALL ARE WELCOME (IEEE Membership not required). REGISTRATION IS ON-SITE
THERE IS NO CHARGE TO ATTEND THE SYMPOSIUM OR SHOW.
COMPLIMENTARY BREAKFAST / LUNCH INCLUDED FOR ALL.
GM SYSTEMS WILL BE HIGHLIGHTING:
AGILE MICROWAVE TECHNOLOGY-RF/MICROWAVE LNA & POWER AMPS AND MULTI-FUNCTION RF & MICROWAVE MODULE
CIRTEK-RF, MILLIMETER WAVE, MICROWAVE ASSEMBLY LOW COST-(OFF SHORE PHILIPPINES) AND PLASTIC PKG.
ES COMPONENTS-DIE, SMT AND PACKAGED PART DISTRIBUTOR-VISHAY HIGH FREQUENCY & MIL-PRF-123 MLCC CAPS, THICK & THIN FILM RESISTORS, & SUBSTRATES, Siliconix JFET, MOSFETs and INTEGRATED CIRCUITS AND MANY OTHERS CLICK FOR LINE CARD
MICROCHIP -WIRELESS AND MICROWAVE MMIC PRODUCTS -DIE AND PACKAGED PARTS, (MICREL, ATMEL, MICROSEMI, SiTIme, VPT COMPONENTS,,SENSITRON,SEMICOA, GOODARK, ZETEX, SEMIKRON
MICROCOAT –EPOXIES AND UV MATERIALS and high temperature adhesives, UV exposure equipment AND TECHCON ADHESIVE DISPENSING EQUIPMENT
TJ GREEN ASSOCIATES -CONSULTING IN RF DESIGN AND PACKAGING -SEMINARS
click image for pdf of the image e and Symposium information
SEPTEMBER 13-VISIT OUR LINKEDIN WEB SITE OR CISSIOD WEB SITE FOR NEW PRODUCTS
SEPTEMBER 3- ON NOVEMBER 7-GM SYSTEMS AND WJB SALES WILL BE EXHIBITING SHOWCASING OUR POWER LINES INCLUDING DISTRIBUTOR ES COMPONENTS -VISHAY-MICREL MICROCHIP-VPT COMPONENTS-MICROSEMI-SENSITRON-SEMICOA -CISSOID SEMICONDUCTOR AND MANY MORE AT THE IEEE LI 2024 Power Electronics Symposium November 7, 2024
FREE TO ALL BUT YOU MUST REGISTER
IEEE LI 2024 Power Electronics Symposium
Event Date : 07 Nov, 2024
Event Location :Hauppauge Radisson 110 Motor Parkway
Hauppauge LI.
Join Us at the IEEE Long Island Power Electronics Symposium, November 7, from Noon to 8 PM at the Hauppauge Radisson, 110 Motor Parkway, Hauppauge, Long Island. Meet with our experts face-to-face to discuss solutions to your power electronics needs. Check out our demos and experience our innovation. Complimentary general admission and parking. Registered attendees will receive admission to the exhibit floor, technical lectures (optional CEU credit pending), lunch, coffee break, swag bag and dinner with pasta station and hors d'oeuvres, cash bar. (Swag bag and lunch are for the first 200 registered attendees.) For more information and registration: https://www.ieee.li/pes We look forward to seeing you there!
EVENT URL :https://www.ieee.li/pes/
AUgust -2 CISSOID's solutions for Silicon Carbide inverter development at the Off-Highway Vehicle Technology Expo Hall 6, Booth 1022
Donald E. Stephens Convention Center
Chicago, USA - 21st to 22nd August, 2024
CISSOID's solutions for Silicon Carbide inverter development
Off-Highway Vehicle Technology Expo
Hall 6, Booth 1022
Donald E. Stephens Convention Center
Chicago, USA - 21st to 22nd August
Introducing our compact EVK-PLA1060 series of On-Board Inverter Reference Designs in the USA, come to have a look at our solutions during the industrial Vehicle Technology Expo at the Donald E. Stephens Convention Center in Chicago, held from 21st to 22nd August, 2024 .
CISSOID sets about devising a way to accelerate the development process even more for traction inverters, resulting in this complete solution, conceived for integration into vehicles ready to undergo in-vehicle and field testing, drastically reducing the time required for system development.
The EVK-PLA1060 On-Board Inverter Reference Design offers easy vehicle mounting with minimal design effort. Furthermore, the modular platform and motor control software allow the user to customize and configure the system.
Designed around our Inverter Control Module (ICM), the solution leverages Silicon Mobility’s ultra-fast OLEA® T222 FPCU (Field Programmable Control Unit) and OLEA® APP - T222 INVERTER control software. The programmable hardware of this application-specific processor accelerates response times to critical events, off-loads the processor cores, and enhances functional safety, while the control software adds powerful optimizations such as dead-time compensation and advanced modulations.
Both the OLEA® T222 processor and OLEA® APP - T222 INVERTER software carry ISO26262 ASIL-D and AUTOSAR 4.3 certification, while the ISO26262 certification of CISSOID’s ICMs is currently in progress.
Off-Highway Vehicle Technology Expo
Hall 6, Booth 1022
Donald E. Stephens Convention Center
Chicago, USA - 21st to 22nd August
Introducing our compact EVK-PLA1060 series of On-Board Inverter Reference Designs in the USA, come to have a look at our solutions during the industrial Vehicle Technology Expo at the Donald E. Stephens Convention Center in Chicago, held from 21st to 22nd August, 2024 .
CISSOID sets about devising a way to accelerate the development process even more for traction inverters, resulting in this complete solution, conceived for integration into vehicles ready to undergo in-vehicle and field testing, drastically reducing the time required for system development.
The EVK-PLA1060 On-Board Inverter Reference Design offers easy vehicle mounting with minimal design effort. Furthermore, the modular platform and motor control software allow the user to customize and configure the system.
Designed around our Inverter Control Module (ICM), the solution leverages Silicon Mobility’s ultra-fast OLEA® T222 FPCU (Field Programmable Control Unit) and OLEA® APP - T222 INVERTER control software. The programmable hardware of this application-specific processor accelerates response times to critical events, off-loads the processor cores, and enhances functional safety, while the control software adds powerful optimizations such as dead-time compensation and advanced modulations.
Both the OLEA® T222 processor and OLEA® APP - T222 INVERTER software carry ISO26262 ASIL-D and AUTOSAR 4.3 certification, while the ISO26262 certification of CISSOID’s ICMs is currently in progress.
AUGUST 1 - THE NEW ISSUE OF TAP TIMES AUGUST 2024
Read the new AUGUST-2024 issue of Tap Times at :
https://taptimes.com/ftp/Aug24/mobile/index.html#p=2
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https://taptimes.com/ftp/Aug24/mobile/index.html#p=2
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JULY 4 - VISHAY Automotive Qualified Polymer Capacitors Provide Stability and Efficiency Over a Long Useful Life
NOW AVAILABLE FROM ES COMPOINENTS-A VISHAY VALUE ADDED DISTRIBUTOR With high C/V density, improved voltage derating, low ESR, long life and a safer failure mode the T51 series provides designers with an improved capacitor solution for filtering and bulk capacitance applications in automotive and other applications
JUNE 10 - MICROCOAT DEVELOPS NEW MATERIALS FOR OPTOCOUPLER AND PHOTONIC APPLICATIONS
MCT OC517-1C is a versatile solution with its flexible, re-workable, and non-conductive silicone-based coating. The balance of peel strength, cohesion, and high-temperature holding power seems to offer a wide range of applications for coating and bonding needs. It's great to see innovations like this that provide flexibility and performance across various uses.
JUNE 6 - ES COMPONENTS SPOTLIGHT ON MICROCHIP
HI-REL DISCRETES SEMICONDUCTORS, RAD HARD MOSFETS, RFMW GaN MMICs SIC DEVICES and SILICON POWER SWITCHING DISCRETES. ES COMPONENTS IS THE SOURCE FOR MICROCHIP BARE DIE, PLASTIC PACKAGING OR HERMETIC DEVICES AND MODULES
CLICK IMAGES FOR MORE INFORMATION ON MICROCHIP FROM ES COMPONENTS YOUR FRANCHISED DISTRIBUTOR
JUNE 1 - AGILE MICROWAVE TECHNOLOGY TO EXHIBIT AT IMS2024 IEEE MTT CONFERENCE AT THE WALTER E. WASHINGTON CONVENTON CENTER - WASHINGTON, D.C.
AGILE MICROWAVE TECHNOLOGY INC WILL BE EXHIBITING AT:
BOOTH LOCATION: 1461 NEAR THE IMS GAME ZONE,
QUANTIC AND PSEMI's BOOTHS
AT THE CENTER OF THE TOP OF THE EXHIBIT FLOOR
Walter E. Washington Convention Center
801 Allen Y. Lew Place WASHINGTON DC
IMS2024 Exhibition Hours:
Tuesday, 18 June 2024 09:30-17:00
Wednesday, 19 June 2024 09:30-18:00
Thursday, 20 June 2024 09:30-15:00
Floorplan
Exhibit Directory
7th STREET
IMS2024 EXHIBIT FLOOR ENTRANCE
MAY 31 - MicroCoat has developed an improved sintered silver conductive die attach material MCT -2-062 – 32 that will cut costs dramatically and has great thermal and electrical properties for improved semiconductor and component die attach.
MicroCoat has the answer with our MCT 2062 – 32 that will cut costs dramatically using this MicroCoat-developed sintered silver conductive die attach material. This material has a thermal conductivity of over 200W/mK just a little less than solder but the die attach process is just the same as any other die attach process.
Tthermal Management for EV Power Electronics
MCT 2062-32
SINTERED SILVER ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE WITHOUT USING SOLDER ALLOYS – TC > 200W/mK
DATASHEET ==> mct_--2-062-32--.pdf
DESCRIPTION
MCT 2062-32 is a high-performance, single-component epoxy adhesive, uniquely formulated with a silver filler, designed for a wide range of applications in the automotive electronics and advanced materials industry. This electrically conductive adhesive boasts remarkable attributes such as fine pitch resolution, exceptional thermal stability, outstanding chemical resistance, and remarkable high-temperature properties. Contact sales@M–coat.com for further information
The automotive industry is using a sintered silver material by the gallons.
So read these two articles and if you have any questions about this material please respond to me.
David Martin VP of Operations
MicroCoat Technologies
Prosper, TX 75078 USA
+1.972.678.4950
davidm@m-coat.com
www.m-coat.com
2024 company vacation July 22 - July 26
Both receiving and shipping are closed
Have you seen these articles??
Thermal Management for EV Power Electronics 2024-2034: Forecasts, Technologies, Markets, and Trends: IDTechEx
The rise of Ag Sintering and Cu Sintering - Electronics Manufacturing News (globalsmt.net)
Tthermal Management for EV Power Electronics
MCT 2062-32
SINTERED SILVER ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE WITHOUT USING SOLDER ALLOYS – TC > 200W/mK
DATASHEET ==> mct_--2-062-32--.pdf
DESCRIPTION
MCT 2062-32 is a high-performance, single-component epoxy adhesive, uniquely formulated with a silver filler, designed for a wide range of applications in the automotive electronics and advanced materials industry. This electrically conductive adhesive boasts remarkable attributes such as fine pitch resolution, exceptional thermal stability, outstanding chemical resistance, and remarkable high-temperature properties. Contact sales@M–coat.com for further information
The automotive industry is using a sintered silver material by the gallons.
So read these two articles and if you have any questions about this material please respond to me.
David Martin VP of Operations
MicroCoat Technologies
Prosper, TX 75078 USA
+1.972.678.4950
davidm@m-coat.com
www.m-coat.com
2024 company vacation July 22 - July 26
Both receiving and shipping are closed
Have you seen these articles??
Thermal Management for EV Power Electronics 2024-2034: Forecasts, Technologies, Markets, and Trends: IDTechEx
The rise of Ag Sintering and Cu Sintering - Electronics Manufacturing News (globalsmt.net)
MAY 5 - TAP TIMES MAY-JUNE ISSUE ON LINE
MARCH 15 NETSOL STT-MRAM AND ASYNCHROUONS SRAM PRODUCT S AVAIALBLE AT DIGIKEY
MARCH 5 -CMSE (Components for Military and Space Electronics ) RELEASES FINAL PROGRAM
The 27th Annual Components for Military and Space Electronics (CMSE) Conference and Exhibit at the Four Points by Sheraton Hotel (Marriott owned) LAX Airport, Los Angeles, California has finalized the keynote talks, speaker presentations and tutorial programs.
The emphasis this year will be on “Component Engineering for the next generation electronic components and new technology insertion” to support our supply chain for military, defense, and space application.
Below is a summary of the conference program; for full conference details and presentation/tutorial abstracts click here
Click here for our Sponsors List from the Media, Exhibitors, Student/Professional Prize Donations including Tap Times, COTS Journal, Microwave Journal, How2Power, everythingRF, SATNow, TopLine Corporation, Kyocera-AVX, Hi-Rel Labs and SMART Microsystems
DAY 1 - April 30, 2024
Tutorial 1 “Microelectronic Component Engineering for the 2020s”
Instructors: Thomas J Green, TJ Green Associates LLC, Ron Demcko, Kyocera/AVX Components Corporation, Trevor Devaney, Hi-Rel Laboratories,
Jon Rhan, Vishay Intertechnology, Inc,
Tutorial 2. “Heterogeneous Integration Packaging Reliability Challenges and Roadmap”
Instructor: Richard Rao, Ph.D., Co-Chair IEEE HIR Reliability TWG, Marvell Technology,
Tutorial 3 “Understanding the Military Standards and Update on JEDEC and New Spec Initiatives”
Instructors: Lawrence Harzstark, Aerospace Corp. Sultan Lilani, Integra Technologies,
Shri Agarwal, NASA Jet Propulsion Laboratory,
DAY 2 - May 1, 2024, Keynote1, Presentations, and Exhibits
Keynote 1 Carl E. McCants, Ph. D.
Special Assistant to the Director, Defense Advanced Research Projects Agency (DARPA) for Microelectronics Policy
Talk Title: “Future Microsystems for Extreme Environments”
Presentations: Approximately 14 presentations on Advanced Packaging, Heterogeneous chip packaging, High-Reliability Polymer Tantalum Capacitors, Categorization, Developments, and Selection for Thermal Interface materials, and a presentation from Joint SAE/JEDEC on Power GaN and SiC Working Group,
Exhibits on Day 2 and Day 3: APPROXIMATELY 40 EXHIBITORS (A FEW EXHIBITOR LOCATIONS STILL AVAILABLE CONTACT TOM TERLIZZI 516-807-9488 OR terlizzi@tjgreenllc.com)
DAY 3 - May 2, 2024, Keynote, Presentations, and Exhibits
Keynote 2 David L. Beck
Branch Chief for Capability Assessment and Principal for Space (Logistics) Industrial Base for the Space Systems Integration Office, Space Systems Command (SSC), Los Angeles Air Force Base, CA
Talk Title: “The Critical Needs of a Resilient Industrial Base”
Presentations: Approximately 14 presentations on Long Term Storage of electronic components and assemblies, Alternate Grade Parts Panel Discussion, NASA Alternate COTS Approach for Space Missions, three presentations on Radiation Hardening of semiconductors and IC’s, three presentations on counterfeiting trends, mitigation, and Combating the problem of acquiring counterfeit microelectronic components, and Lessons Learned from upscreening plastic parts for hi-reliability applications,
FEBRUARY 1 - TAP TIMES FEBRUARY 2024 ISSUE AVAILABLE- CLICK IMAGE FOR THIS ISSUE
JANUARY 12 - TJGREEN ASSOCIATES LLC HOST CMSE CONFERENCE AND EXHIBIT-APRIL 30-MAY 2 , 2024
THE 27TH ANNUAL CMSE CONFERENCE-CLICK IMAGES BELOW FOR MORE INFORMATION TO PRESENT, EXHIBIT OR ATTEND THE CONFERENCE, TUTORIAL AND STUDENT SESSIONS
APRIL 30 - MAY 2 | 2024
We are now accepting submissions for presentations for CMSE 2024.
If you are interested in contributing to our dynamic program, we encourage you to review
this year's Call for Presentations and submit your abstract.
Deadline Extended: February 14, 2024
APRIL 30 - MAY 2 | 2024
We are now accepting submissions for presentations for CMSE 2024.
If you are interested in contributing to our dynamic program, we encourage you to review
this year's Call for Presentations and submit your abstract.
Deadline Extended: February 14, 2024
PRELIMIARY PROGRAM -FINAL PROGRAM MARCH 15,2024
JANUARY 5 - TAP TIMES JANUARY 2024 ISSUE AVAILABLE
JANUARY 1 - TREBOR INSTRUMENTS SOLDERABILITY TESTER /DIPPER AVAILABLE FROM STOCK MODEL188
EMAIL: treborinst@hotmail.com
PHONE: 631-291-8127
PHONE: 631-291-8127
PRESS RELEASES 2023
DECEMBER 1 - TAP TIMES DECEMBER 2023 ISSUE
December 2023 --
Features
FIRST
Will India ever become a semiconduc-
tor superpower?
This South Asian country, whose
population, according to U.N. estimates, now slightly
exceeds China’s, has been striving for decades to estab-
lish a thriving semiconductor industry. And for decades,
this goal has been elusive. Is there now light at the end
of the chip-making tunnel? Editor Ron Iscoff,
SECOND
The advanced packaging market is fore-
cast to reach $78.6 billion by 2028.
The
advanced packaging market will have a 10.6% CAGR
between 2022 and 2028 to reach $78.6 billion at the end
of 2028, the Yole Group reports, 11.
CLICK IMAGE BELOW FOR FULL ARTICLES
Features
FIRST
Will India ever become a semiconduc-
tor superpower?
This South Asian country, whose
population, according to U.N. estimates, now slightly
exceeds China’s, has been striving for decades to estab-
lish a thriving semiconductor industry. And for decades,
this goal has been elusive. Is there now light at the end
of the chip-making tunnel? Editor Ron Iscoff,
SECOND
The advanced packaging market is fore-
cast to reach $78.6 billion by 2028.
The
advanced packaging market will have a 10.6% CAGR
between 2022 and 2028 to reach $78.6 billion at the end
of 2028, the Yole Group reports, 11.
CLICK IMAGE BELOW FOR FULL ARTICLES
CLICK IMAGE FOR FULL ISSUE
NOVEMBER 20 - HAPPY THANKSGIVING -NOV. 23,2023
“As the year progresses and Thanksgiving approaches, we are reminded of how grateful we are for customers like you. Thank you for being an integral part of our GM Systems family.
LEAST WE NOT FORGET OUR MANY PARTNERS, SUPPLIERS BUSINESS ASSOCIATES, AND FRIENDS THAT WE THANK YOU SO MUCH FOR YOUR SUPPORT!!!
May your Thanksgiving be as warm and heartfelt as your support has been to us.”
LEAST WE NOT FORGET OUR MANY PARTNERS, SUPPLIERS BUSINESS ASSOCIATES, AND FRIENDS THAT WE THANK YOU SO MUCH FOR YOUR SUPPORT!!!
May your Thanksgiving be as warm and heartfelt as your support has been to us.”
NOVEMBER 14 -TAP TIMES ANNOUNCES EDITORIAL CALENDAR AND AD RATE SCHEDULE FOR 2024
In 2024, TAP TIMES will mark its 15th year of publication serving the semiconductor and related industries. Each year we review a wide range of issues that involve our readers’ areas of interest. In 2020, we added emerging technolo-
gies to our editorial coverage, including photo-
voltaics and batteries.
Our vast range of coverage includes important ad-
vancements in the business as well as the technology of
semiconductors, MEMS, nano-devices, photovoltaics
(solar), batteries and materials.
Within the semiconductor packaging and test industry,
we also look at chip design, development, materials,
methods, and device fabrication.
Our editorial advisory board, comprised of industry
veterans, ensures that are articles are timely and accu-
rate.
The Editor
Assisted by industry experts, Editor Ron Iscoff, who
founded TAP TIMES in 2009, brings nearly 40 years’
experience to the publication.
SEE PDF BELOW OF THE EDITORIAL CALENDAR AND ADVERTISING RATE SCHEDULE AND DETAILS ON HOW TO ADVERTISE IN "TAP TIMES"
| 2024_editorial_calendar-rates_final_102423.pdf |
OCTOBER 10 - AGILE MICROWAVE TO EXHIBT AT MWE 2023 Microwave Workshops and Exhibition, November 29 - December 1, 2023-Venue-Exhibition Hall, Pacifico Yokohama
CLICK IMAGE FOR LINK TO MWE JAPAN 2023 WEB SITE
VISIT US AT Booth No. H-05 OUR SALES REPRESENTATIVE FOR JAPAN - IMC Corporation (I・M・C, Ltd.)
SEPTEMBER 1 - MICROCOAT TECHNOLOGIES LAUNCHES NEW WEB SITE FOR ASIA/PACIFIC FOR ADVANCED ADHESIVES AND CONFORMAL COATINGS
MICROCOAT TECHNOLOGIES AND MEGACHIP SEMICON ELECTRONICS CORP HAVE LAUNCHED A NEW WEB SITE FOR ASIA/PACIFIC MARKET FOR
"Unparalleled in UV Cure Polymer Technology, Conductive and Very High Temperature Advance Adhesives for Semiconductor and Microelectronics, and Conformal Coatings.".
ABOUT MICROCOAT TECHNOLOGIES CLICK HERE
ABOUT MEGACHIPSEMICON ELECTRONICS CORP
"Unparalleled in UV Cure Polymer Technology, Conductive and Very High Temperature Advance Adhesives for Semiconductor and Microelectronics, and Conformal Coatings.".
ABOUT MICROCOAT TECHNOLOGIES CLICK HERE
ABOUT MEGACHIPSEMICON ELECTRONICS CORP
-------CLICK IMAGE TO ENLARGE -------FOR MORE INFORMATION CONTACT----
-----------TOM TERLIZZI TERLIZZI@GMSYSTEMS.COM 516-807-9488---
AUGUST 23 - TJ GREEN TO HOST TWO VIRTUAL TRAINING RF/MICROWAVE COURSES in September, 2023
TJ Green Associates LLC announced it will be offering two three-day microwave courses (~ 2 hours each day) September 19 and September 26, 2023, respectively. These virtual classes run 2 hours a day for 3 days (Noon to 2PM EDT) and if you miss a session, you can catch the video replay.
The First Course on September 19 has been developed for engineers or technologist with an Introduction to RF and Microwave Engineering, RF and Microwave Circuit Design, Antenna Design and Analysis, RF Measurements and Testing and other topics. Dr. Chandra Gupta brings real world applications to the forefront with his RF/Microwave design experience a Analog Devices and Hittite Semiconductors.
The Second course on September 26 is for process and quality engineers, designers, and managers who are responsible for microwave hybriddesign, development, and manufacturing and takes an in-depth look at all aspects of microwave packaging assembly processes including epoxy and
eutectic attach of MMICs, diodes, thin film ceramic and soft Teflon boards along with fine wire deep access wedge and ribbon bonding, laser welding
and more. TOM GREEN shares valuable lessons learned from OVER 30 years of experience microelectronic process engineering and student training.
FOR MORE INFORMATION CLICK HERE FOR PRESS RELEASE
TO REGISTER CLICK HERE AND LEARN MORE
The First Course on September 19 has been developed for engineers or technologist with an Introduction to RF and Microwave Engineering, RF and Microwave Circuit Design, Antenna Design and Analysis, RF Measurements and Testing and other topics. Dr. Chandra Gupta brings real world applications to the forefront with his RF/Microwave design experience a Analog Devices and Hittite Semiconductors.
The Second course on September 26 is for process and quality engineers, designers, and managers who are responsible for microwave hybriddesign, development, and manufacturing and takes an in-depth look at all aspects of microwave packaging assembly processes including epoxy and
eutectic attach of MMICs, diodes, thin film ceramic and soft Teflon boards along with fine wire deep access wedge and ribbon bonding, laser welding
and more. TOM GREEN shares valuable lessons learned from OVER 30 years of experience microelectronic process engineering and student training.
FOR MORE INFORMATION CLICK HERE FOR PRESS RELEASE
TO REGISTER CLICK HERE AND LEARN MORE
AUGUST 17 - GM SYSTEMS TO EXHIBIT AT SMTA LI Expo and Tech Forum SEPTEMBER 13, 2023 CLICK ON IMAGES OR SCAN THE "QR CODE" BELOW
- GM SYSTEMS WILL BE HIGHLIGHTING
- -MICROPRINTING SYSTEMS FOR SCREEN PRINTING EQUIPMENT (THICK FILM, SOLDER PASTE, EPOXY AND NANO MATERIALS) &
- -ES COMPONENTS A DISTRIBUTOR OF SMT COMPONENTS-RESISTORS-CAPACITORS -SEMICONDUCTORS, IC’s FROM VISHAY, MICROCHIP, MICREL, VPT COMPONENTS, VPG, KNOWLES
- -AGILE MICROWAVE TECHNOLOGY RF AMPLIFIERS AND MULTIFUNCTION RF/MICROWAVE MODULES AND HYBRID CIRCUITS
- -CIRTEK (PHILLIPINES) SMT, RF-MICROWAVE, HYBRID AND SEMICONDUCTOR ASSEMBLY-PLASTIC PACKAGES=LOW COST
- -MICROCOAT TECHNOLOGIES-EPOXIES-UV MATERIALS
- -TJ GREEN MICROELECTRONIC CONSULTING AND TRAINING
- AND THE COMPONENTS FOR MILITARY AND SPACE ELECTRONICS (CMSE) CONFERENCE AND EXHIBIT APRIL 29-MAY 3, 2024
GM SYSTEMS ALSO PROVIDES MICROELECTRONIC MANUFACTURING, SALES, MARKETING, ENGINEERING, DESIGN, PMP, QA CONSULTING AND TRAINING.
FOR MORE INFORMATION
516-807-9488. TERLIZZI@GMSYSTEMS.COM
When:Wednesday, September 13, 2023
Where:Marriott Melville Long Island
1350 Walt Whitman Road
Melville, New York 11747
United States
Contact:SMTA Headquarters - Madison Soliday
expos@smta.org
952-920-7682
CLICK HERE FOR REGISTRATION LINK
Online registration is available until: 9/13/2023
AUGUST 15 - GM SYSTEMS TO EXHIBIT AT THE IEEE LONG ISLAND POWER ELECTRONICS SYMPOSIUM NOVEMBER 2, 2023- HIGHLIGHTING ES COMPONENTS, CISSOID, CIRTEK
Join Us at the IEEE Long Island Power Electronics Symposium, November 2, from Noon to 8 PM at the Hauppauge Radisson, 110 Motor Parkway, Hauppauge, Long Island. Meet with our experts face-to-face to discuss solutions to your power electronics needs. Check out our demos and experience our innovation.
Complimentary general admission and parking. Registered attendees will receive admission to the exhibit floor, technical lectures (optional CEU credit pending), lunch, coffee break, swag bag and dinner with pasta station and hors d'oeuvres, cash bar. (Swag bag and lunch are for the first 200 registered attendees.)
For more information and registration: https://www.ieee.li/pes
We look forward to seeing you there!
Complimentary general admission and parking. Registered attendees will receive admission to the exhibit floor, technical lectures (optional CEU credit pending), lunch, coffee break, swag bag and dinner with pasta station and hors d'oeuvres, cash bar. (Swag bag and lunch are for the first 200 registered attendees.)
For more information and registration: https://www.ieee.li/pes
We look forward to seeing you there!
JULY 16 - EPOXY PLUS AND MICROPRINTING SYSTEMS ACHIEVES DLA CERTIFICATION AND CAGE CODE ASSIGNMENT (MORE BREAKING NEWS CLICK HERE)
JULY 1 - READ TERLIZZI'S ARTICLE ON THE HISTORY OF THE TRANSISTOR INVENTION 75 YEARS AGO
THE TAP TIMES ISSUE JULY 1, 2023 HAS SEVERAL ARTICLES ON THE HISTORY OF THE TRANSISTOR AND SILICON VALLEY.
CLICK HERE FOR ARTICLE or click image below
CLICK HERE FOR ARTICLE or click image below
JUNE 6 - MicroCoat Technologies anaounced its MCT 34T71ND-2 a single-component, toughened microelectronic grade package sealant
MicroCoat Technologies MCT 34T71ND-2 is a single-component, toughened microelectronic grade package sealant. It is designed for use in various applications such as military, medical, optoelectronics, automotive sensors, and LCP (Liquid Crystal Polymer) packages. Here are the key features and advantages of this product:
Features:
• Single-component system: No need for mixing before use.
• No viscosity changes over time.
• Room temperature storable for 30 days.
• Versatile cure schedules available.
• High shear and peel strength: Suitable for bonding similar and dissimilar substrates.
• Wide temperature range: Can withstand temperatures from -65°C to 340°C.
• Color changes slightly to amber above 300°C.
• Low moisture absorption: H2O absorption is less than 0.04%, similar to LCP.
• Passes MSL1 (Moisture Sensitivity Level 1) requirements: Can be used in MSL1 packaging.
• Excellent performance in environmental testing: Passes 3500 hours at 85°C/85% RH (Relative Humidity).
• Passes Gross Leak - Seal Integrity test: Meets Mil-Std-883 Method 5005 Sub Group 3 Mil-Std-883 1014 2 Gross Leak Test.
• Passes Gross Leak after 500 cycles from -65°C to +150°C.
• Good electrical insulating properties and chemical resistance.
• Superior resistance to thermal shock, impact, and stress cracking fatigue.
• Meets NASA low outgassing specifications: ASTM E-595, NASA MSFC 1443, Mil-Std-883 5011.4 (3.8.6).
• RoHS compliant: Does not contain hazardous substances.
For further information or a Technical Data Sheet (TDS) for this material, you can contact MicroCoat at SALES@M–coat.com. or terlizzi@gmsystems.com
Features:
• Single-component system: No need for mixing before use.
• No viscosity changes over time.
• Room temperature storable for 30 days.
• Versatile cure schedules available.
• High shear and peel strength: Suitable for bonding similar and dissimilar substrates.
• Wide temperature range: Can withstand temperatures from -65°C to 340°C.
• Color changes slightly to amber above 300°C.
• Low moisture absorption: H2O absorption is less than 0.04%, similar to LCP.
• Passes MSL1 (Moisture Sensitivity Level 1) requirements: Can be used in MSL1 packaging.
• Excellent performance in environmental testing: Passes 3500 hours at 85°C/85% RH (Relative Humidity).
• Passes Gross Leak - Seal Integrity test: Meets Mil-Std-883 Method 5005 Sub Group 3 Mil-Std-883 1014 2 Gross Leak Test.
• Passes Gross Leak after 500 cycles from -65°C to +150°C.
• Good electrical insulating properties and chemical resistance.
• Superior resistance to thermal shock, impact, and stress cracking fatigue.
• Meets NASA low outgassing specifications: ASTM E-595, NASA MSFC 1443, Mil-Std-883 5011.4 (3.8.6).
• RoHS compliant: Does not contain hazardous substances.
For further information or a Technical Data Sheet (TDS) for this material, you can contact MicroCoat at SALES@M–coat.com. or terlizzi@gmsystems.com
MAY 1 - HIGHLIGHTS from the 26th Annual Components for Military & Space Electronics (CMSE) Conference & Exhibition April 25-27, 2023 Four Points by Sheraton (LAX) Los Angeles, California
MARCH 1 - TJ GREEN ASSOCIATES & GM SYSTEMS TO EXHIBIT AT THE NEW ENGLAND IMAPS SYMPOSIUM ON MAY 2, 2023
-TJ GREEN ASSOCIATES -MICROELECTRONICS ASSEMBLY TRAINING , FA, CONSULTING AND CMSE CONFERENCE
AND GM SYSTEMS-REPING ES COMPONENTS, NETSOL AGILE MICROWAVE TECHNOLOGY, MPS SCREEN PRINTERS,
ARE EXHIBITING iMAPS New England 49th Symposium & Expo
2023 Theme "There's Magic in Microelectronics"
at Boxboro Regency Hotel & Conference Center Boxborough, MA
May 2, 2023
https://lnkd.in/eEEZifUd
Full Symposium - Member $70.00
Full Symposium - Non-Member $80.00
Full Symposium New Member (includes iMAPS Membership dues of $95.00) $165.00
Exhibits with Lunch$30.00
Exhibits Only No Charge
https://imapsne.org/
AND GM SYSTEMS-REPING ES COMPONENTS, NETSOL AGILE MICROWAVE TECHNOLOGY, MPS SCREEN PRINTERS,
ARE EXHIBITING iMAPS New England 49th Symposium & Expo
2023 Theme "There's Magic in Microelectronics"
at Boxboro Regency Hotel & Conference Center Boxborough, MA
May 2, 2023
https://lnkd.in/eEEZifUd
Full Symposium - Member $70.00
Full Symposium - Non-Member $80.00
Full Symposium New Member (includes iMAPS Membership dues of $95.00) $165.00
Exhibits with Lunch$30.00
Exhibits Only No Charge
https://imapsne.org/
PRESS RELEASE 2022
DECEMBER 16 - The transistor at 75 years: The most important invention of the 20th century?
CLICK IMAGE FOR IEEE ARTICLES "TRANSISTOR AT 75 YEARS"
NOVEMBER 22 - MICROCOAT TECHNOLOGY ISSUES FIRST EDTION OF GAZETTE ON MICROCOAT PRODUCTS AND APPLICATIONS
MicroCoat Technologies flexes its high-tech muscle with military, medical, aerospace, Down-Hole,
solar, etc. adhesives, and coatings. The company's diverse offerings include UV, Thermal & Air Cure Coatings and Adhesives for the SMD/PCB Assembly, Microelectronics – Chip and Wire, Die Attach, and virtually any industry. The company's largest customer base is in the US and MCT does about 70% of its business onshore. The headquarters is in Prosper, Texas with satellite facilities in CT and NC. Below are but a few of our >3000 formulations for high-tech applications IN THE NOVEMBER 2022 GAZETTE BELOW
solar, etc. adhesives, and coatings. The company's diverse offerings include UV, Thermal & Air Cure Coatings and Adhesives for the SMD/PCB Assembly, Microelectronics – Chip and Wire, Die Attach, and virtually any industry. The company's largest customer base is in the US and MCT does about 70% of its business onshore. The headquarters is in Prosper, Texas with satellite facilities in CT and NC. Below are but a few of our >3000 formulations for high-tech applications IN THE NOVEMBER 2022 GAZETTE BELOW
| nov_2022_gazette-t2.docx |
NOVEMBER 15 -MICROCOAT TECHNOLOGY TO MARKET AND SELL TECHCON EQUIPMENT FOR DISPENSING AND MIXING EPOXY MATERIALS.
Accurately Dispense Two Component (2K) Material With Dual PC Pump TS8200D Micro-Meter Mix Dispensing System
Key Applications
Key Applications
- Bonding
- Glob-Top Potting and Encapsulation
- Battery Pack Sealing
- Thermal Paste Dispensing
- Filling
CLICK IMAGES FOR APPLICATION VIDEOPAGE
FOR MORE INFORMATION CONTACT TOM TERLIZZI 516-807-9488 OR EMAIL TERLIZZI@GMSYSTEMS.COM
NOVEMBER 12 - WJ BECKER SALES AND GM SYSTEMS EXHIBITED AT THE 2022 LONG ISLAND IEEE POWER ELECTRONICS SYMPOSIUM ON NOVEMBER 3, 2022
Photos and lectures from the 2022 IEEE LI Power Electronics Symposium have been posted.
https://www.ieee.li/pes/2022
Thank you for STOPPING BY OUR TABLE TOP EXHIBIT AND FOR your interest!
https://www.ieee.li/pes/2022
Thank you for STOPPING BY OUR TABLE TOP EXHIBIT AND FOR your interest!
OCTOBER 10-GM SYSTEMS EXIBITS AT LONG ISLAND SMTA EXPO OCTOBER 19TH (SEE BELOW)
CLICK HERE TO VIEW IN BROWSER
GM SYSTEMS WILL BE HIGHLIGHTING AT SMTA LONG ISLAND:
MICRO PRINTING SYSTEMS INTERNATIONAL is the worldwide manufacture and supplier of the MPS screen printers,
Models TF100 and SP1500, (>1,000 sold world wide) to the hybrid, ceramic, micro-electronic, medical and SMT/PC solder paste industries. WITH ON CONTACT FEATURES AND METAL MASK STENCILS MANY UNIQUE THIXOTROPIC MATERIALS MAY BE PRINTED IN A LAB OR PRODUCTION ENVIRONMENT
ES COMPONENTS-DIE, SMT AND PACKAGED PART DISTRIBUTOR-VISHAY PASSIVE AND ACTIVE SMT COMPONENTS & MIL-PRF-123 MLCC CAPS, THICK & THIN FILM RESISTORS, & SUBSTRATES, Siliconix JFET, MOSFETs and INTEGRATED CIRCUITS AND MANY OTHERS CLICK FOR LINE CARD
MICROCOAT –EPOXIES AND UV MATERIALS and high temperature adhesives. ALSO UV EPOXY AND COATING CURING AND DISPENSING EQUIPMENT
PPI SYSTEMS is a leading global supplier of laser solutions for via drilling and cutting rigid, and flex PCB panels as well as trimming systems for thin and thick film resistors on standard and advanced hybrid substrates, semiconductor wafers and PCB materials.
ES COMPONENTS
DISTRIBUTOR OF SMT PASSIVE AND ACTIVE COMPONENTS✤ PACKAGED DEVICES DISTRIBUTION
✤ BARE DIE DISTRIBUTION
✤ STOCKING PROGRAMS/VALUE-ADD SERVICES
MANUFACTURER✤ CUSTOM PACKAGING
✤ ES COMPONENTS BRAND MANUFACTURING
Who And What We AreProducts and Services Provided By A Dedicated Team Of ProfessionalsOur team is committed to providing the highest level of quality products and services meeting or exceeding requirements, delivered on time, at best prices.A Franchised Distributor With Selective Quality SuppliersOur franchise lines fit our Philosophy of LESS IS MORE. We have a small group of leading edge and legacy suppliers that have synergy and compatible high reliability products focused on the Military, Aerospace, Industrial and Energy Markets.A Manufacturer of Our Own Proprietary High Reliability ComponentsES Components provides proprietary (Siliconix Inside) JAN and Military Qualified High Reliability Components, through acquisition and design.
Now Representing NETSOL CO LTD. IS ALL USAGM SYSTEMS: We're representing Netsol Co Ltd in the USA. A fabless memory semiconductor company in South Korea, developing non-commodity memory products with high standard of quality & reliability. Memory products: Async Fast SRAM, & Low Power SRAM, Sync SRAM, DDR SRAM, QUADRUPLE SRAM & STT-MRAM (SEE POWERPOINT PRESENTATION FOR STT-MRAM) GM SYSTEMS is USA marketing and sales representative ALSO A REMINDER OF THE OTHER PRODUCT LINES WE REPRESENT
ASSEMBLY--HYBRID-SEMICONDUCTOR-MCM-SENSOR-SMT-MODULE, SYSTEM
ACT-BOX/SMT/HYBRID/CONTRACT MFG. NY-USA MANUFACTURER-ITAR-MILITARY AEROSPACE-COMMERCIAL
CIRTEK-OFFSHORE RF/MICROWAVE/MMW CHIP AND WIRE ASSEMBLIES AND PLASTIC DEVICE PACKAGING-QFN-SOT
ES COMPONENTS- Your 1st Choice For Solutions for hermetic devices per MIL-PRF-38535 Manufacturer(Siliconix Analog Switches)
MIL-PRF-19500 and MIL-PRF-38535 Siliconix Military Products(JFET’s / MOSFET’s)
RF-MICROWAVE-HIGH FREQUENCY
AGILE MICROWAVE TECHNOLOGY- RF/MICROWAVE LNA & POWER AMPS AND MULTI-FUNCTION RF & MICROWAVE MODULE
-STANDARD LNA, POWER AMPS, MIXERS MMICS AND CUSTOM AUREL MICROELCTRONIC – WIRELESS MODULES, THICK FILM HYBRIDS – AL-NITRIDE- INSULATED METAL SUBSTRATES, SMTMMICS AND FOUNDRY SERVICES TO 200GHZ
TJ GREEN LLC-RF/MICROWAVE TRAINING and WORKMANSHIP STANDARDS FOR MICROELECTRONIC ASSEMBLY, CONSULTING,
MIL-PRF-38534/MIL-STD-883 FAILURE ANALYSIS & THE CMSE SYMPOSIUM (COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
DTA-SA-RF/MICROWAVE GROUND, AVIONIC/ SPACE COMPONENTS & -U/C-D/C, FILTERS, SPLITTERS COMBINER, DIPLEXERS
MICROELECTRONIC MATERIALS & ELECTRONIC COMPONENTS
MICROCOAT –EPOXIES AND UV MATERIALS and high temperature adhesives
KOARTAN MICROELECTRONIC INTERCOMNNECT MATERIALS a US manufacture of thick film pastes which include silver, gold, and copper conductors, resistors, NTC and PTC thermistors, multilayer, cross-over, capacitor dielectrics, and sealing glasses,
COMPONENT SUPPLIERS/DISTRIBUTORS
ES COMPONENTS-DIE, SMT AND PACKAGED PART DISTRIBUTOR-VISHAY HIGH FREQUENCY & MIL-PRF-123 MLCC CAPS, THICK & THIN FILM RESISTORS, & SUBSTRATES, Siliconix JFET, MOSFETs and INTEGRATED CIRCUITS AND MANY OTHERS CLICK FOR LINE CARD
MICROCHIP -WIRELESS PRODUCTS -DIE AND PACKAGED PARTS, (MICREL, ATMEL, MICROSEMI, SiTIme, KNOWLES,VPT COMPONENTS,,SENSITRON,SEMICOA, GOODARK, ZETEX, SEMIKRON
MICRO PRINTING SYSTEMS INTERNATIONAL is the worldwide manufacture and supplier of the MPS screen printers,
Models TF100 and SP1500, (1,000 sold world wide) to the hybrid, ceramic, micro-electronic, medical and SMT/PC solder paste industries.
LASER RESISTOR TRIMMERS, Laser Via Drilling-Cutting and Probing Systems
PPI SYSTEMS is a leading global supplier of laser solutions for via drilling and cutting rigid, and flex PCB panels as well as trimming systems for thin and thick film resistors on standard and advanced hybrid substrates, semiconductor wafers and PCB materials.
HIGH TEMPERATURE COMPONENTS
CISSOID- is the leader in high temperature semiconductors for demanding market. With a focus on the Automotive Market Cissoid deliver solutions for efficient power conversion and compact motor drives: high voltage gate drivers for SiC & GaN transistors, Power Modules featuring low inductances and enhanced thermal performance, and automotive grade components rated at 175°C in excess of the AEC-Q100 Grade 0 qualification standard. For the Aviation, Industrial & Oil & Gas Markets Cissoid provide solutions for harsh environment signal conditioning, motor control, timing and power supplies that provide reliable operation from -55°C to +225°C.
CONSULTING
TJ GREEN LLC-RF/MICROWAVE/HYBRID TRAINING FOR MICROELECTRONIC ASSEMBLY, CONSULTING, MIL-PRF-38534/MIL-STD-883 FAILURE ANALYSIS, eLEARNING AND THE CMSE TRADE SHOW (COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
GM SYSTEMS LLC -offers services in these four Key areas MARKETING-ENGINEERING-MANUFACTURING-SALES-MANAGEMENT....
'WE MAKE THINGS HAPPEN.........................."Weekend warrior service available".......need help on critical crisis, engineering problem, proposalS with insane deadline PM&P(PARTS, MATERIAL AND PROCESS) for space and military systems ...call us for help....click here
MICRO PRINTING SYSTEMS INTERNATIONAL is the worldwide manufacture and supplier of the MPS screen printers,
Models TF100 and SP1500, (>1,000 sold world wide) to the hybrid, ceramic, micro-electronic, medical and SMT/PC solder paste industries. WITH ON CONTACT FEATURES AND METAL MASK STENCILS MANY UNIQUE THIXOTROPIC MATERIALS MAY BE PRINTED IN A LAB OR PRODUCTION ENVIRONMENT
ES COMPONENTS-DIE, SMT AND PACKAGED PART DISTRIBUTOR-VISHAY PASSIVE AND ACTIVE SMT COMPONENTS & MIL-PRF-123 MLCC CAPS, THICK & THIN FILM RESISTORS, & SUBSTRATES, Siliconix JFET, MOSFETs and INTEGRATED CIRCUITS AND MANY OTHERS CLICK FOR LINE CARD
MICROCOAT –EPOXIES AND UV MATERIALS and high temperature adhesives. ALSO UV EPOXY AND COATING CURING AND DISPENSING EQUIPMENT
PPI SYSTEMS is a leading global supplier of laser solutions for via drilling and cutting rigid, and flex PCB panels as well as trimming systems for thin and thick film resistors on standard and advanced hybrid substrates, semiconductor wafers and PCB materials.
ES COMPONENTS
DISTRIBUTOR OF SMT PASSIVE AND ACTIVE COMPONENTS✤ PACKAGED DEVICES DISTRIBUTION
✤ BARE DIE DISTRIBUTION
✤ STOCKING PROGRAMS/VALUE-ADD SERVICES
MANUFACTURER✤ CUSTOM PACKAGING
✤ ES COMPONENTS BRAND MANUFACTURING
Who And What We AreProducts and Services Provided By A Dedicated Team Of ProfessionalsOur team is committed to providing the highest level of quality products and services meeting or exceeding requirements, delivered on time, at best prices.A Franchised Distributor With Selective Quality SuppliersOur franchise lines fit our Philosophy of LESS IS MORE. We have a small group of leading edge and legacy suppliers that have synergy and compatible high reliability products focused on the Military, Aerospace, Industrial and Energy Markets.A Manufacturer of Our Own Proprietary High Reliability ComponentsES Components provides proprietary (Siliconix Inside) JAN and Military Qualified High Reliability Components, through acquisition and design.
Now Representing NETSOL CO LTD. IS ALL USAGM SYSTEMS: We're representing Netsol Co Ltd in the USA. A fabless memory semiconductor company in South Korea, developing non-commodity memory products with high standard of quality & reliability. Memory products: Async Fast SRAM, & Low Power SRAM, Sync SRAM, DDR SRAM, QUADRUPLE SRAM & STT-MRAM (SEE POWERPOINT PRESENTATION FOR STT-MRAM) GM SYSTEMS is USA marketing and sales representative ALSO A REMINDER OF THE OTHER PRODUCT LINES WE REPRESENT
ASSEMBLY--HYBRID-SEMICONDUCTOR-MCM-SENSOR-SMT-MODULE, SYSTEM
ACT-BOX/SMT/HYBRID/CONTRACT MFG. NY-USA MANUFACTURER-ITAR-MILITARY AEROSPACE-COMMERCIAL
CIRTEK-OFFSHORE RF/MICROWAVE/MMW CHIP AND WIRE ASSEMBLIES AND PLASTIC DEVICE PACKAGING-QFN-SOT
ES COMPONENTS- Your 1st Choice For Solutions for hermetic devices per MIL-PRF-38535 Manufacturer(Siliconix Analog Switches)
MIL-PRF-19500 and MIL-PRF-38535 Siliconix Military Products(JFET’s / MOSFET’s)
RF-MICROWAVE-HIGH FREQUENCY
AGILE MICROWAVE TECHNOLOGY- RF/MICROWAVE LNA & POWER AMPS AND MULTI-FUNCTION RF & MICROWAVE MODULE
-STANDARD LNA, POWER AMPS, MIXERS MMICS AND CUSTOM AUREL MICROELCTRONIC – WIRELESS MODULES, THICK FILM HYBRIDS – AL-NITRIDE- INSULATED METAL SUBSTRATES, SMTMMICS AND FOUNDRY SERVICES TO 200GHZ
TJ GREEN LLC-RF/MICROWAVE TRAINING and WORKMANSHIP STANDARDS FOR MICROELECTRONIC ASSEMBLY, CONSULTING,
MIL-PRF-38534/MIL-STD-883 FAILURE ANALYSIS & THE CMSE SYMPOSIUM (COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
DTA-SA-RF/MICROWAVE GROUND, AVIONIC/ SPACE COMPONENTS & -U/C-D/C, FILTERS, SPLITTERS COMBINER, DIPLEXERS
MICROELECTRONIC MATERIALS & ELECTRONIC COMPONENTS
MICROCOAT –EPOXIES AND UV MATERIALS and high temperature adhesives
KOARTAN MICROELECTRONIC INTERCOMNNECT MATERIALS a US manufacture of thick film pastes which include silver, gold, and copper conductors, resistors, NTC and PTC thermistors, multilayer, cross-over, capacitor dielectrics, and sealing glasses,
COMPONENT SUPPLIERS/DISTRIBUTORS
ES COMPONENTS-DIE, SMT AND PACKAGED PART DISTRIBUTOR-VISHAY HIGH FREQUENCY & MIL-PRF-123 MLCC CAPS, THICK & THIN FILM RESISTORS, & SUBSTRATES, Siliconix JFET, MOSFETs and INTEGRATED CIRCUITS AND MANY OTHERS CLICK FOR LINE CARD
MICROCHIP -WIRELESS PRODUCTS -DIE AND PACKAGED PARTS, (MICREL, ATMEL, MICROSEMI, SiTIme, KNOWLES,VPT COMPONENTS,,SENSITRON,SEMICOA, GOODARK, ZETEX, SEMIKRON
MICRO PRINTING SYSTEMS INTERNATIONAL is the worldwide manufacture and supplier of the MPS screen printers,
Models TF100 and SP1500, (1,000 sold world wide) to the hybrid, ceramic, micro-electronic, medical and SMT/PC solder paste industries.
LASER RESISTOR TRIMMERS, Laser Via Drilling-Cutting and Probing Systems
PPI SYSTEMS is a leading global supplier of laser solutions for via drilling and cutting rigid, and flex PCB panels as well as trimming systems for thin and thick film resistors on standard and advanced hybrid substrates, semiconductor wafers and PCB materials.
HIGH TEMPERATURE COMPONENTS
CISSOID- is the leader in high temperature semiconductors for demanding market. With a focus on the Automotive Market Cissoid deliver solutions for efficient power conversion and compact motor drives: high voltage gate drivers for SiC & GaN transistors, Power Modules featuring low inductances and enhanced thermal performance, and automotive grade components rated at 175°C in excess of the AEC-Q100 Grade 0 qualification standard. For the Aviation, Industrial & Oil & Gas Markets Cissoid provide solutions for harsh environment signal conditioning, motor control, timing and power supplies that provide reliable operation from -55°C to +225°C.
CONSULTING
TJ GREEN LLC-RF/MICROWAVE/HYBRID TRAINING FOR MICROELECTRONIC ASSEMBLY, CONSULTING, MIL-PRF-38534/MIL-STD-883 FAILURE ANALYSIS, eLEARNING AND THE CMSE TRADE SHOW (COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
GM SYSTEMS LLC -offers services in these four Key areas MARKETING-ENGINEERING-MANUFACTURING-SALES-MANAGEMENT....
'WE MAKE THINGS HAPPEN.........................."Weekend warrior service available".......need help on critical crisis, engineering problem, proposalS with insane deadline PM&P(PARTS, MATERIAL AND PROCESS) for space and military systems ...call us for help....click here
OCTOBER 10 - GM SYSTEMS EXHIBITS AT 36TH ANNUAL IEEE-MTT-APS SYMPOSIUM AND MINI-SHOW ON 10/3/22
THANKS FOR STOPPING BY THE N.J. IEEE SYMPOSIUM..........
GREAT TO BE BACK LIVE.
GM SYSTEMS HAS BEEN SUPPORTING THE NJ IEEE CHAPTER SINCE 2016
WE HIGHLIGHTED THE FOLLOWING PRODUCT LINES FOR RF AND MICROWAVE APPLICATIONS:
ASSEMBLY--HYBRID-SEMICONDUCTOR-MCM-SENSOR-SMT-MODULE, SYSTEM
ACT-BOX/SMT/HYBRID/CONTRACT MFG. NY-USA MANUFACTURER-ITAR-MILITARY AEROSPACE-COMMERCIAL
CIRTEK-OFFSHORE RF/MICROWAVE/MMW CHIP AND WIRE ASSEMBLIES AND PLASTIC DEVICE PACKAGING-QFN-SOT
ES COMPONENTS- Your 1st Choice For Solutions for hermetic devices per MIL-PRF-38535 Manufacturer(Siliconix Analog Switches)
MIL-PRF-19500 and MIL-PRF-38535 Siliconix Military Products(JFET’s / MOSFET’s)
RF-MICROWAVE-HIGH FREQUENCY
AGILE MICROWAVE TECHNOLOGY- RF/MICROWAVE LNA & POWER AMPS AND MULTI-FUNCTION RF & MICROWAVE MODULE
STANDARD LNA, POWER AMPS, MIXERS MMICS AND CUSTOM MMICS AND FOUNDRY SERVICES TO 200GHZ
AUREL MICROELCTRONIC – WIRELESS MODULES, THICK FILM HYBRIDS – AL-NITRIDE- INSULATED METAL SUBSTRATES, SMT
TJ GREEN LLC-RF/MICROWAVE TRAINING and WORKMANSHIP STANDARDS FOR MICROELECTRONIC ASSEMBLY, CONSULTING,
MIL-PRF-38534/MIL-STD-883 FAILURE ANALYSIS & THE CMSE SYMPOSIUM (COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
DTA-SA-RF/MICROWAVE GROUND, AVIONIC/ SPACE COMPONENTS & -U/C-D/C, FILTERS, SPLITTERS COMBINER, DIPLEXERS
MICROELECTRONIC MATERIALS & ELECTRONIC COMPONENTS
MICROCOAT –EPOXIES AND UV MATERIALS and high temperature adhesives
KOARTAN MICROELECTRONIC INTERCOMNNECT MATERIALS a US manufacture of thick film pastes which include silver, gold, and copper conductors, resistors, NTC and PTC thermistors, multilayer, cross-over, capacitor dielectrics, and sealing glasses,
COMPONENT SUPPLIERS/DISTRIBUTORS
ES COMPONENTS-DIE, SMT AND PACKAGED PART DISTRIBUTOR-VISHAY HIGH FREQUENCY & MIL-PRF-123 MLCC CAPS, THICK & THIN FILM RESISTORS, & SUBSTRATES, Siliconix JFET, MOSFETs and INTEGRATED CIRCUITS AND MANY OTHERS CLICK FOR LINE CARD
MICROCHIP -WIRELESS PRODUCTS -DIE AND PACKAGED PARTS, (MICREL, ATMEL, MICROSEMI, SiTIme, KNOWLES,VPT COMPONENTS,,SENSITRON,SEMICOA, GOODARK, ZETEX, SEMIKRON
MICRO PRINTING SYSTEMS INTERNATIONAL is the worldwide manufacture and supplier of the MPS screen printers,
Models TF100 and SP1500, (1,000 sold world wide) to the hybrid, ceramic, micro-electronic, medical and SMT/PC solder paste industries.
LASER RESISTOR TRIMMERS, Laser Via Drilling-Cutting and Probing Systems
PPI SYSTEMS is a leading global supplier of laser solutions for via drilling and cutting rigid, and flex PCB panels as well as trimming systems for thin and thick film resistors on standard and advanced hybrid substrates, semiconductor wafers and PCB materials.
HIGH TEMPERATURE COMPONENTS
CISSOID- is the leader in high temperature semiconductors for demanding market. With a focus on the Automotive Market Cissoid deliver solutions for efficient power conversion and compact motor drives: high voltage gate drivers for SiC & GaN transistors, Power Modules featuring low inductances and enhanced thermal performance, and automotive grade components rated at 175°C in excess of the AEC-Q100 Grade 0 qualification standard. For the Aviation, Industrial & Oil & Gas Markets Cissoid provide solutions for harsh environment signal conditioning, motor control, timing and power supplies that provide reliable operation from -55°C to +225°C.
CONSULTING
TJ GREEN LLC-RF/MICROWAVE/HYBRID TRAINING FOR MICROELECTRONIC ASSEMBLY, CONSULTING, MIL-PRF-38534/MIL-STD-883 FAILURE ANALYSIS, eLEARNING AND THE CMSE TRADE SHOW (COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
GM SYSTEMS LLC -offers services in these four Key areas MARKETING-ENGINEERING-MANUFACTURING-SALES-MANAGEMENT....
'WE MAKE THINGS HAPPEN.........................."Weekend warrior service available".......need help on critical crisis, engineering problem, proposalS with insane deadline PM&P(PARTS, MATERIAL AND PROCESS) for space and military systems ...call us for help....click here
GREAT TO BE BACK LIVE.
GM SYSTEMS HAS BEEN SUPPORTING THE NJ IEEE CHAPTER SINCE 2016
WE HIGHLIGHTED THE FOLLOWING PRODUCT LINES FOR RF AND MICROWAVE APPLICATIONS:
ASSEMBLY--HYBRID-SEMICONDUCTOR-MCM-SENSOR-SMT-MODULE, SYSTEM
ACT-BOX/SMT/HYBRID/CONTRACT MFG. NY-USA MANUFACTURER-ITAR-MILITARY AEROSPACE-COMMERCIAL
CIRTEK-OFFSHORE RF/MICROWAVE/MMW CHIP AND WIRE ASSEMBLIES AND PLASTIC DEVICE PACKAGING-QFN-SOT
ES COMPONENTS- Your 1st Choice For Solutions for hermetic devices per MIL-PRF-38535 Manufacturer(Siliconix Analog Switches)
MIL-PRF-19500 and MIL-PRF-38535 Siliconix Military Products(JFET’s / MOSFET’s)
RF-MICROWAVE-HIGH FREQUENCY
AGILE MICROWAVE TECHNOLOGY- RF/MICROWAVE LNA & POWER AMPS AND MULTI-FUNCTION RF & MICROWAVE MODULE
STANDARD LNA, POWER AMPS, MIXERS MMICS AND CUSTOM MMICS AND FOUNDRY SERVICES TO 200GHZ
AUREL MICROELCTRONIC – WIRELESS MODULES, THICK FILM HYBRIDS – AL-NITRIDE- INSULATED METAL SUBSTRATES, SMT
TJ GREEN LLC-RF/MICROWAVE TRAINING and WORKMANSHIP STANDARDS FOR MICROELECTRONIC ASSEMBLY, CONSULTING,
MIL-PRF-38534/MIL-STD-883 FAILURE ANALYSIS & THE CMSE SYMPOSIUM (COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
DTA-SA-RF/MICROWAVE GROUND, AVIONIC/ SPACE COMPONENTS & -U/C-D/C, FILTERS, SPLITTERS COMBINER, DIPLEXERS
MICROELECTRONIC MATERIALS & ELECTRONIC COMPONENTS
MICROCOAT –EPOXIES AND UV MATERIALS and high temperature adhesives
KOARTAN MICROELECTRONIC INTERCOMNNECT MATERIALS a US manufacture of thick film pastes which include silver, gold, and copper conductors, resistors, NTC and PTC thermistors, multilayer, cross-over, capacitor dielectrics, and sealing glasses,
COMPONENT SUPPLIERS/DISTRIBUTORS
ES COMPONENTS-DIE, SMT AND PACKAGED PART DISTRIBUTOR-VISHAY HIGH FREQUENCY & MIL-PRF-123 MLCC CAPS, THICK & THIN FILM RESISTORS, & SUBSTRATES, Siliconix JFET, MOSFETs and INTEGRATED CIRCUITS AND MANY OTHERS CLICK FOR LINE CARD
MICROCHIP -WIRELESS PRODUCTS -DIE AND PACKAGED PARTS, (MICREL, ATMEL, MICROSEMI, SiTIme, KNOWLES,VPT COMPONENTS,,SENSITRON,SEMICOA, GOODARK, ZETEX, SEMIKRON
MICRO PRINTING SYSTEMS INTERNATIONAL is the worldwide manufacture and supplier of the MPS screen printers,
Models TF100 and SP1500, (1,000 sold world wide) to the hybrid, ceramic, micro-electronic, medical and SMT/PC solder paste industries.
LASER RESISTOR TRIMMERS, Laser Via Drilling-Cutting and Probing Systems
PPI SYSTEMS is a leading global supplier of laser solutions for via drilling and cutting rigid, and flex PCB panels as well as trimming systems for thin and thick film resistors on standard and advanced hybrid substrates, semiconductor wafers and PCB materials.
HIGH TEMPERATURE COMPONENTS
CISSOID- is the leader in high temperature semiconductors for demanding market. With a focus on the Automotive Market Cissoid deliver solutions for efficient power conversion and compact motor drives: high voltage gate drivers for SiC & GaN transistors, Power Modules featuring low inductances and enhanced thermal performance, and automotive grade components rated at 175°C in excess of the AEC-Q100 Grade 0 qualification standard. For the Aviation, Industrial & Oil & Gas Markets Cissoid provide solutions for harsh environment signal conditioning, motor control, timing and power supplies that provide reliable operation from -55°C to +225°C.
CONSULTING
TJ GREEN LLC-RF/MICROWAVE/HYBRID TRAINING FOR MICROELECTRONIC ASSEMBLY, CONSULTING, MIL-PRF-38534/MIL-STD-883 FAILURE ANALYSIS, eLEARNING AND THE CMSE TRADE SHOW (COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
GM SYSTEMS LLC -offers services in these four Key areas MARKETING-ENGINEERING-MANUFACTURING-SALES-MANAGEMENT....
'WE MAKE THINGS HAPPEN.........................."Weekend warrior service available".......need help on critical crisis, engineering problem, proposalS with insane deadline PM&P(PARTS, MATERIAL AND PROCESS) for space and military systems ...call us for help....click here
CLICK IMAGE TO ENLARGE VIEW
SEPTEMBER 25 - GMSYSTEMS TO EXHIBIT AT NORTH NEW JESERY IEEE MICROWAVE MINI-SHOW ON OCTOBER 6 AT THE SMTA SHOW ON LONG ISLAND OCTOBER 19 and at the IEEE Long Island Power Conference November 3
CLICK IMAGE FOR DETAILS IN A PDF
at the IEEE MTT/ APS we are highlighting
AGILE MICROWAVE TECHNOLOGY INC.,and ES COMPONENTS
FOR A LIST OF (~40) OTHER EXHIBITORS CLICK HERE --->
AGILE MICROWAVE TECHNOLOGY INC.,and ES COMPONENTS
FOR A LIST OF (~40) OTHER EXHIBITORS CLICK HERE --->
CLICK IMAGE FOR MORE INFORMATION
at the SMTA-LONG ISLAND SHOW we will be highlighting Micro Printing Systems (MPS)
TF100 SCREEN PRINTER.
TF100 SCREEN PRINTER.
IEEE Long Island Power Conference November 3
SEPTEMBER 7 - ES COMPONENTS REPRESENTS ICEMOS TECHNOLOGY CORPORATION FOR DIE AND PACKAGED DEVICES
IceMOS MEMS MOSFET is the high voltage MOSFET of "Superjunction Technology". By the combing Silicon MOSFET technology and MEMS process technology, IceMOS provides world-best-in-class performance. Well-known MEMS technology has been developed by unique manufacturing processes in contrast to MOSFET technology which continues progress mainly for smaller dimension. The combination of both technologies encourages advances in extreme performance of MOSFET.
Fast Facts & Figures OceMOS Technology Corporation
Company Overview
Application Guide:High Voltage Superjunction MOSFET
Press Release -
IceMOS Moon To Mars
Fast Facts & Figures OceMOS Technology Corporation
Company Overview
Application Guide:High Voltage Superjunction MOSFET
Press Release -
IceMOS Moon To Mars
CLICK IMAGE FOR DOWNLOADABLE PDF
SEPT 1 - MICROCOAT TECHNOLOGIES ANNOUNCES
SUPPORT FOR OPTOELECTRONICS/OPTOCOUPLERS
CLICK LINK FOR MICROCOAT OPTOCOUPLER PRESENTATION
AUGUST 15 - GM SYSTEMS TO REPRESENT AND MARKET
NETSOL CO. MEMORY PRODUCTS IN U.S.A.
GM SYSTEMS: We're representing Netsol Co Ltd in the USA. A fabless memory semiconductor company in South Korea, developing non-commodity memory products with high standard of quality & reliability. Memory products: Async Fast SRAM, & Low Power SRAM, Sync SRAM, DDR SRAM, QUADRUPLE SRAM & STT-MRAM (SEE POWERPOINT PRESENTATION FOR STT-MRAM)
------------------------->CLICK IMAGE FOR NETSOL STT-MRAM PRESENTATION
AUGUST 6 - ES COMPONENTS HIGHLIGHTS VISHAY NTC Thermistor SURFACE MOUNT RESISTORS
New Product Release - NTC Thermistor Die
With support for wire bonding, soldering, and non-silver paste sintering — with high resistance to leaching, formic acid etching, and forming gasses — Vishay's new leadless NTC thermistor dies with silver metallization offer versatile mounting options.
Learn More
AUGUST 1 - ES COMPONENTS HIGHLIGHTS KNOWLES PRECISION PRODUCTS GROUP
ES COMPONENTS REPRESENT ALL THE Knowles Precision Devices
CAPACITOR LINES BELOW :
Dielectric Labs, Johanson, Syfer, Voltronics and, Novacap.
the catalogs can be found at https://www.knowlescapacitors.com/Catalogues.aspx
CAPACITOR LINES BELOW :
Dielectric Labs, Johanson, Syfer, Voltronics and, Novacap.
the catalogs can be found at https://www.knowlescapacitors.com/Catalogues.aspx
CLICK IMAGE TO ENLARGE
Knowles Precision Devices, leading global innovator of high-performance solutions.As a division of Knowles Corporation, Knowles Precision Devices (KPD), focuses on production of a wide variety of highly engineered Capacitors and Microwave to Millimeter Wave components for use in critical applications in military, medical, electric vehicle, and 5G market segments. Radar, pacemakers, MRI equipment, satellites, airplanes, electric vehicles and mobile phone base stations are just a few of the places you will find our products. Our products can be found in every corner of the world, from 8000ft below the earth’s surface to orbiting 254 miles above us on the ISS.
We are a Specialty Components manufacturer, which means we choose to take on the complex challenges that come with High Reliability, High Temperature, High Performance and High Frequency solutions. This is built on our commitment to innovation, whether it be our ongoing creativity in manufacturing high performance multi-layer ceramic capacitors, or our unique ceramic formulations that allow us to provide the highest performance-for-footprint mmWave filters available,
A Short History of Knowles Precision Devices
We are a Specialty Components manufacturer, which means we choose to take on the complex challenges that come with High Reliability, High Temperature, High Performance and High Frequency solutions. This is built on our commitment to innovation, whether it be our ongoing creativity in manufacturing high performance multi-layer ceramic capacitors, or our unique ceramic formulations that allow us to provide the highest performance-for-footprint mmWave filters available,
A Short History of Knowles Precision Devices
- In 1985 Dielectric Laboratories, DLI (High-Q Multi-Layer Capacitors and Single-Layer Capacitors, Resonators, Filters, Broadband DC blocks, Thin Film components) became part of Dover Corporation. DLI had previously invented the Single Layer Capacitor in 1974.
- Shortly after in 1987 Novacap (specialized MLCC products to serve unique and difficult high reliability, military and space requirements) joined the family
- In the year 2000 Syfer (MLCC products to serve demanding commercial and industrial requirements) came on board, having just invented Flexicap, an approach to avoiding MLCC cracking that the entire capacitor industry has since adopted. At the same time we created the Cap-Rack approach to increasing capacitance in a reduced footprint
- Voltronics (world leader in precision variable capacitors) was brought in in 2004 to expand our multi turn trimmer capabilities.
- Further development of high CV capacitors followed with the creation of StackiCap technology in 2012
- In 2014 Knowles Corporation was established as a publicly traded company. DLI, Novacap Syfer and Voltronics formed the new Precision Devices division.
- Johanson Manufacturing, a world-class supplier of trimmer capacitors, non-magnetic variable inductors and microwave tuning elements, joined our company in 2017
- To complement our existing strengths in Single Layer Capacitors, Compex was acquired in 2018.
- Diablo Thin Film Industries (DTIF) joined Knowles in the DLI group in January 2019.
- IMC joined Knowles Precision Devices in 2021 to further bolster our RF and microwave solutions portfolio.
JULY 6 - MICROCOAT TECHNOLOGIES PRODUCT OFFERINGS FOR OVER 3000 FORMULATIONS ADHESIVE AND COATING APPLICATIONS FOR CRITICAL APPLICATIONS
Microcoat Technologies
For Automotive – many different types from conductive to non-conductive including high thermal conductivity B-Stage adhesives and films
Conductors. We manufacture over 100 different types of silver-bearing conductive adhesives. Some with thermal conductivity of over 44W/mK that is being used for high-reliability military missions from aerospace to rockets.
Down-hole. Extremely high temperature conductive and non-conductive polyimide adhesives with a Tg of over 320C. These materials are used mostly for the die attach of small die for oil well drilling circuitry on high-temperature laminates or hybrid circuits
Drinking-Water Safe adhesives. MicroCoat has supplied manufacturers of Mr. Coffee coffee makers with adhesives for over 20 years
Elastomerics. Many types of soft materials that are either UV cured or are in the silicone family
Electronics. Adhesives and conformal coatings for the assembly of PCBs
Equipment. Several types of UV cure equipment
Adhesives for ferrite bonding.
Glass bonders. UV cure adhesives for the manufacture of glass furniture and any other glass or plastic assembly
UV cure materials for creating hearing aids.
Coatings for inductors.
Medical-grade adhesives and coatings for the assembly of needles, face masks, and many other types of assemblies.
Coatings and adhesives for all phases of microelectronics assembly. From conductive and non-conductive adhesives to glob tops and underfills
Materials for motor balancing.
Coatings and adhesives for all types of optoelectronic assemblies with an RI of 1.4 to 1,7
Coatings and adhesives for the manufacture of sensors. We supply several different types of adhesives to the automotive industry for the manufacturer of sensors and many other optoelectronic assemblies
Adhesives for SMD assembly. The red adhesive for attaching chip components to PCBs
MicroCoat SuperCure adhesives - Cyanoacrylates. We have about 150 different types of “superglue” Cyanoacrylates
Adhesives For the manufacture of thermoelectric heaters/coolers
Glass replacement coatings for thick-film hybrid circuits
Extremely high-temperature conductive adhesives to 1500 degrees centigrade
In total, we have between 3000 and 4000 formulations for all of these categories. There is no company that you go into that does not use some type of adhesive. Just let us know what you are presently using and we will see if we have comparable material . Be sure that you look at all of our Micorocoat PowerPoint presentations on our website. Especially for UV cure materials. The presentations shows you all of the reasons why you should use UV cure systems. Most important if you have any questions about a material that a customer requires please contact us at
terlizzi@GMSYSTEMS.COM OR CALL AT 516-807--9488
For Automotive – many different types from conductive to non-conductive including high thermal conductivity B-Stage adhesives and films
Conductors. We manufacture over 100 different types of silver-bearing conductive adhesives. Some with thermal conductivity of over 44W/mK that is being used for high-reliability military missions from aerospace to rockets.
Down-hole. Extremely high temperature conductive and non-conductive polyimide adhesives with a Tg of over 320C. These materials are used mostly for the die attach of small die for oil well drilling circuitry on high-temperature laminates or hybrid circuits
Drinking-Water Safe adhesives. MicroCoat has supplied manufacturers of Mr. Coffee coffee makers with adhesives for over 20 years
Elastomerics. Many types of soft materials that are either UV cured or are in the silicone family
Electronics. Adhesives and conformal coatings for the assembly of PCBs
Equipment. Several types of UV cure equipment
Adhesives for ferrite bonding.
Glass bonders. UV cure adhesives for the manufacture of glass furniture and any other glass or plastic assembly
UV cure materials for creating hearing aids.
Coatings for inductors.
Medical-grade adhesives and coatings for the assembly of needles, face masks, and many other types of assemblies.
Coatings and adhesives for all phases of microelectronics assembly. From conductive and non-conductive adhesives to glob tops and underfills
Materials for motor balancing.
Coatings and adhesives for all types of optoelectronic assemblies with an RI of 1.4 to 1,7
Coatings and adhesives for the manufacture of sensors. We supply several different types of adhesives to the automotive industry for the manufacturer of sensors and many other optoelectronic assemblies
Adhesives for SMD assembly. The red adhesive for attaching chip components to PCBs
MicroCoat SuperCure adhesives - Cyanoacrylates. We have about 150 different types of “superglue” Cyanoacrylates
Adhesives For the manufacture of thermoelectric heaters/coolers
Glass replacement coatings for thick-film hybrid circuits
Extremely high-temperature conductive adhesives to 1500 degrees centigrade
In total, we have between 3000 and 4000 formulations for all of these categories. There is no company that you go into that does not use some type of adhesive. Just let us know what you are presently using and we will see if we have comparable material . Be sure that you look at all of our Micorocoat PowerPoint presentations on our website. Especially for UV cure materials. The presentations shows you all of the reasons why you should use UV cure systems. Most important if you have any questions about a material that a customer requires please contact us at
terlizzi@GMSYSTEMS.COM OR CALL AT 516-807--9488
JULY 2 - THANKS FOR ATTENDING MTT-IMS2022 IN DENVER,COLORADO AND MEETING US AT THE AGILE MICROWAVE TECHNOLGY EXHIBIT BOOTH. SEE YOU NEXT YEAR AT
San Diego Convention Center, 13-15 June 2023
JUNE 13 - GM SYSTEMS' PRODUCT LINES
AGILE MICROWAVE TECHNOLOGY (7095)
TO EXHIBIT (2096) AT IMS2022 in DENVER, CO
Tuesday, 21 June 2022: 09:30-17:00
Wednesday, 22 June 2022: 09:30-18:00
Thursday, 23 June 2022: 09:30-15:00
JUNE 6- ES Components Keeps Your Business Moving, Then & Now.........
ES Components is made of a talented team of professionals, well versed in specific needs of the customers in
THE MARKETS WE SERVE and backed by a deep understanding of our principal’s products and what they can support. Understanding and paying attention to the details of our customers’ needs, is an important part of the services we provide.With the introduction of every New Year comes a human need for reflection of years past. In our drive to do better, we look to the rear-view mirror for glimpses of experiences that may help to guide us more effectively forward. It is equally important to look proudly upon our accomplishments which then become our Legacy.The evolution of ES Components tells a story of a company that has advanced to support the needs of both its customers and the world-class suppliers in the industry. ES Components 40+ year history is rich in innovation to support obsolete semiconductors. This road travelled required creative thinking, a true “definition” of innovation.Founded as a Joint Venture with Elmo Semiconductor, ES Components supported the demands of east coast customers, requiring High Reliability components in bare die Form, for use in Military end products.Awarded the Vishay Franchise in 1995 ES Components became a Full Service Distributor, with the full franchise including Dale, Electro-Films, Semiconductors, Sfernice, Siliconix, Sprague, Thin-Film(Ohmtek), Vitramon, and others.When ES Components was founded by Ike Aubrey in 1981 the pace of technological advancements within the semiconductor industry began to result in a significant increase of end-of-life (EOL) components that were critical to customer applications.
Our goal was to provide customers with an ongoing source of supplier authorized components ; while ensuring a traceable, certified, and guaranteed supply, supporting High-Reliability and Industrial Customers with longer product lifecycles.Through the years, ES Components has continued to increase Supplier authorizations. In response to the needs of our customers, ES Components has expanded our authorized supplier base while broadening our product offerings to include bare die, packaged devices, and obsolete component semiconductors.In addition to in-stock inventory, we have expanded to include ES Components Brand Manufacturing. In 2019, ES Components became a DLA Certified MIL-PRF-38535 (QML Listed) manufacturer, and now offers many Class Q ICs previously supported by the Siliconix division of Vishay. In addition to MIL-PRF-38535 qualified products, ES Components can provide parts that are processed to the equivalent military flows of MIL-PRF-19500 (-2) and MIL-PRF-38535 (-3).ES Components has the largest inventory of obsolete die dating back to early 1980’s. These materials are often used by legacy Military Programs and to satisfy DMSMS requirements. These items are all segregated by the manufacturer’s lot number and the majority of them have the original manufacturer’s C of Cs.In 2018 ES Components became a Certified WBENC Woman Owned Small Business.Most recently, in 2021 ES Components became an Authorized Franchised Distributor from VPT Components for Packaged and Die Components. VPT Components is one of the largest providers of JAN certified semiconductors for the military, defense, space and aerospace industries.As the markets change, so will we. ES Components is focused on providing solutions to meet the ever-growing needs of our customers anytime, around the world. – ES Components has kept your business moving, then and now.
NEWSLETTER SIGNUP
READ MORE NEWS
THE MARKETS WE SERVE and backed by a deep understanding of our principal’s products and what they can support. Understanding and paying attention to the details of our customers’ needs, is an important part of the services we provide.With the introduction of every New Year comes a human need for reflection of years past. In our drive to do better, we look to the rear-view mirror for glimpses of experiences that may help to guide us more effectively forward. It is equally important to look proudly upon our accomplishments which then become our Legacy.The evolution of ES Components tells a story of a company that has advanced to support the needs of both its customers and the world-class suppliers in the industry. ES Components 40+ year history is rich in innovation to support obsolete semiconductors. This road travelled required creative thinking, a true “definition” of innovation.Founded as a Joint Venture with Elmo Semiconductor, ES Components supported the demands of east coast customers, requiring High Reliability components in bare die Form, for use in Military end products.Awarded the Vishay Franchise in 1995 ES Components became a Full Service Distributor, with the full franchise including Dale, Electro-Films, Semiconductors, Sfernice, Siliconix, Sprague, Thin-Film(Ohmtek), Vitramon, and others.When ES Components was founded by Ike Aubrey in 1981 the pace of technological advancements within the semiconductor industry began to result in a significant increase of end-of-life (EOL) components that were critical to customer applications.
Our goal was to provide customers with an ongoing source of supplier authorized components ; while ensuring a traceable, certified, and guaranteed supply, supporting High-Reliability and Industrial Customers with longer product lifecycles.Through the years, ES Components has continued to increase Supplier authorizations. In response to the needs of our customers, ES Components has expanded our authorized supplier base while broadening our product offerings to include bare die, packaged devices, and obsolete component semiconductors.In addition to in-stock inventory, we have expanded to include ES Components Brand Manufacturing. In 2019, ES Components became a DLA Certified MIL-PRF-38535 (QML Listed) manufacturer, and now offers many Class Q ICs previously supported by the Siliconix division of Vishay. In addition to MIL-PRF-38535 qualified products, ES Components can provide parts that are processed to the equivalent military flows of MIL-PRF-19500 (-2) and MIL-PRF-38535 (-3).ES Components has the largest inventory of obsolete die dating back to early 1980’s. These materials are often used by legacy Military Programs and to satisfy DMSMS requirements. These items are all segregated by the manufacturer’s lot number and the majority of them have the original manufacturer’s C of Cs.In 2018 ES Components became a Certified WBENC Woman Owned Small Business.Most recently, in 2021 ES Components became an Authorized Franchised Distributor from VPT Components for Packaged and Die Components. VPT Components is one of the largest providers of JAN certified semiconductors for the military, defense, space and aerospace industries.As the markets change, so will we. ES Components is focused on providing solutions to meet the ever-growing needs of our customers anytime, around the world. – ES Components has kept your business moving, then and now.
NEWSLETTER SIGNUP
READ MORE NEWS
MAY 15 -MICROCOAT TECHNOLOGIES ANNOUNCES NEW HIGH TEMPERATURE MATERIAL MCT34-DH19
FOR MORE INFORMATION EMAIL TERLIZZI@GMSYSTEMS .COM
APRIL 1 -VIRTUAL EXHIBITOR PRESENTATION FOR CMSE
(COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
April 25-29,2022
COMPANIES VIRTUALLY EXHIBITNG AT CMSE
K&L Services Group Inc. specializes in providing electronics manufacturing services
Fablicator 3D Printers
KEMET a Yageo Company
Pacific Rim Engineering
CISSOID-HIGH TEMP SEMICONDUCTORS
MICRO PRINTING SYSTEMS INTERNATIONAL (MPS)
MICROCOAT TECHNOLOGIES
AUREL MICROELECTRONICS
AGILE MICROWAVE TECHNOLOGY INC.
everythingRF..... is one of the most popular websites for the RF & Microwave Industry
MEPTEC (MicroElectronics Packaging and Test Engineering Council) is a trade association of
COTS Journal is a technology-in-context book for embedded technology
How2Power.com a website created to help engineers generate power conversion solutions
TAP TIMES.....A DIGITAL MAGAZINE FOR SEMICONDUCTORS
Gel-Pak
Linear Systems
OPTOMEC-3D PRINTED ELECTRONICS
MicroCircuit Laboratories
Vanguard Electronics
epirus INC
CYBORD
PRESIDIO COMPONENTS
SMART MICROSYSTEMS LTD.
ES COMPONENTS
The EPCI European Passive Components Institute
Microwave Journal
Hi-Rel Laboratories
AVX
GM SYSTEMS LLC
MARCH 15 - CMSE
(COMPONENTS FOR MILITARY AND SPACE ELECTRONICS) FOLLOWED BY 10TIMES EVENT WEB SITE
FEBRUARY 17 - ES COMPONENTS HAS STOCK FOR VPT
JAN JANS JANTX JANTXV TRANSISTORS AND DIODES
VPT STOCK FOR ~775 PART TYPES AND A LARGE TOTAL QUANTITY
PLEASE CONTACT US
terlizzi@gmsystems or 516-807-9488
PLEASE CONTACT US
terlizzi@gmsystems or 516-807-9488
FEBRUARY 2 - CALL FOR PRESENTATION FOR CMSE
(COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
Components for Military & Space Electronics Conferenceencourages you to submit a presentation for this year's virtual conference planned for April 25-29,2022. Your participation is important to the success of CMSE.
There is still time to submit an abstract for consideration by the CMSE Technical Program Committee.
Abstract submission deadline is Friday, February 18, 2022.
CLICK HERE FOR MORE INFO.......
To learn more about virtual exhibiting at CMSE 2022 email Tom Terlizzi at terlizzi@tjgreenllc.com.
Check out the video (CLICK IMAGE BELOW) to see what CMSE is all about!
JANUARY 27 - MICROCOAT TECHNOLOGIES DEVELOPS 300 DEGREE C- ELECTRICALLY CONDUCTIVE ADHESIVE
MCT 34-DH19
CLICK IMAGE FOR MCT-DH19 HIGH TEMPERATURE ELECTRICALLY CONDUCTIVE ADHESIVE DATA SHEET
MicroCoat Technologies
MicroCoat Technologies flexes its high-tech muscle with military, medical, aerospace, down-the-hole, solar, etc. adhesives and coatings. The company's diverse offerings include UV, Thermal & Air Cure Coatings and Adhesives for the SMD/PCB Assembly, Microelectronics – Chip and Wire, Die Attach, and for virtually any industry. The company's largest customer base is in the US and MCT does about 85% of their business onshore. Headquarters is in McKinney, Texas with satellite facilities in CT and NC
FOR MORE INFORMATION CONTACT TOM TERLIZZI 1-516-807-9488 OR EMAIL terlizzi@gmsystems.com
MicroCoat Technologies flexes its high-tech muscle with military, medical, aerospace, down-the-hole, solar, etc. adhesives and coatings. The company's diverse offerings include UV, Thermal & Air Cure Coatings and Adhesives for the SMD/PCB Assembly, Microelectronics – Chip and Wire, Die Attach, and for virtually any industry. The company's largest customer base is in the US and MCT does about 85% of their business onshore. Headquarters is in McKinney, Texas with satellite facilities in CT and NC
FOR MORE INFORMATION CONTACT TOM TERLIZZI 1-516-807-9488 OR EMAIL terlizzi@gmsystems.com
JANUARY 14 - VPG RELEASES APR - Standardized Precision Resistors- The new platform of standardized precision resistors Made-to-Stock - High Performance - Short Delivery
VPG's new APR product line responds to market demands of trending applications like 5G or EV Charging equipment to provide off-the- shelf, A+ class, standard surface mount resistors in tape & reel packaging and power current-sense resistors with resistance values based on E24 & E96 codes complying with the AEC-Q200 standardization.
When better is good enough
With an increased level of standardization, APR components are the preferred choice for applications that are demanding, but not in need of utmost component performance. Building on decades of expertise in resistor manufacturing, we utilize the technology that meets the objective: metal strip, thin film, thick film, metal foil.
For higher performances, tighter specifications up to EEE/QPL levels, or any customization requirements, our customers can rely on our AA and AAA product lines. VPG Foil Resistors is your one-stop-shop for precision resistors. Contact us at terlizzi@gmsystems.com fordetailson your demanding applications
When better is good enough
With an increased level of standardization, APR components are the preferred choice for applications that are demanding, but not in need of utmost component performance. Building on decades of expertise in resistor manufacturing, we utilize the technology that meets the objective: metal strip, thin film, thick film, metal foil.
For higher performances, tighter specifications up to EEE/QPL levels, or any customization requirements, our customers can rely on our AA and AAA product lines. VPG Foil Resistors is your one-stop-shop for precision resistors. Contact us at terlizzi@gmsystems.com fordetailson your demanding applications
CLICK IMAGE FOR PDF OF APR SERIES DETAILS
JANUARY 12 - GM SYSTEMS TO REPRESENT SKYMOONS TECHNOLOGY, INC., S.KOREA.
Skymoons Technology Inc is a South Korean based company engaged in communication and broadcasting equipment manufacturing business. It manufactures and sells mobile repeater system such as 2G/3G/4G/5G repeater system, and Satellite DMB Gap-Filter.
CLICK HERE FOR SKYMOONS WEB SITE
Indoor Repeaters -Transceivers
-Cables -RF Switches (High Frequency)- SP4P to SP16P
-Reflective & Absorptive -Test and Measurement Instrument
-Pin & Coaxial Types -Defense Industry
-Wireless Router -Broadcasting devices
-RF signal booster/REPEATERS -Telecommunication Industry
and Custom wireless devices -Space Industry
Miscellaneous Customization -Fiber Optic solution
High Frequency Microwave Components -5G Telecommunications’ devices
for more information contact Tom Terlizzi terlizzi@gmsystems.com
CLICK HERE FOR SKYMOONS WEB SITE
Indoor Repeaters -Transceivers
-Cables -RF Switches (High Frequency)- SP4P to SP16P
-Reflective & Absorptive -Test and Measurement Instrument
-Pin & Coaxial Types -Defense Industry
-Wireless Router -Broadcasting devices
-RF signal booster/REPEATERS -Telecommunication Industry
and Custom wireless devices -Space Industry
Miscellaneous Customization -Fiber Optic solution
High Frequency Microwave Components -5G Telecommunications’ devices
for more information contact Tom Terlizzi terlizzi@gmsystems.com
JANUARY 10 - Vishay To Acquire Substantially All of the Assets of Barry Industries for $21 Million
MALVERN, Pa., Dec. 15, 2021 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc., (NYSE: VSH), .....to " purchase agreement to acquire substantially all of the assets and certain liabilities of Barry Industries for $21 million, subject to working capital and net cash adjustments at closing. " Based in Attleboro, MA, privately-held Barry Industries is a leading globally recognized and vertically integrated manufacturer of semiconductor packaging and resistive components including terminations, resistors and attenuators. An ISO9001 certified, ITAR registered company, Barry Industries is an approved supplier to the leading manufacturers of military, commercial, aerospace, medical and fiber-optic devices." (CLICK HERE FOR FULL PRES RELEASE)
JANUARY 3 - HAPPY NEW YEAR 2022 FRIENDS, CLIENTS, CUSTOMERS, ASSOCIATES AND GM SYSTEMS' FAMILY
About every year or two, there is a moment of truth where there's some new development in the marketplace, some new technology, some sort of existential crisis. You just have to be vigilant about looking out for those moments. - Author: Jeremy Stoppelman
PRESS RELEASES-2021
DECEMBER 13 - CISSOID & Silicon Mobility Announce Partnership for Compact & Efficient SiC Inverters for New Energy Vehicles
CISSOID and Silicon Mobility announced the
integration of Silicon Mobility's OLEA FPCU controller with CISSOID's Silicon Carbide (SiC) Intelligent Power Module (IPM) platform. This new highly integrated platform is designed to accelerate the development of compact and efficient SiC Inverters for EV motor drives.
The partnership will deliver a SiC Inverter modular platform offering highly integrated hardware and optimized software: a power module and its gate driver with protections and fault management, an ultra-fast FPCU controller and its application software optimized for e-motor control. CISSOID's IPMs integrate a 3-Phase 1200V/340A-550A SiC MOSFET Power Module with a temperature-robust gate driver enabling low switching losses and high power density. Silicon Mobility's OLEA FPCU controller and OLEA APP INVERTER software are designed to enable fast and highly efficient electric motor control.
"Silicon Mobility ultra-fast OLEA FPCU is the perfect technology to control our SiC IPM platform in motor drive applications," says Pierre Delatte, CTO of CISSOID. "The capability of SiC power modules to switch faster and to operate at higher frequencies makes it essential to have access to a controller technology capable of running real-time algorithms faster. OLEA FPCU low power consumption is also a key advantage in building highly compact and efficient traction inverters".
The resulting SiC Inverter platform is planned to be made available for customers by early Q2-2022.
For more information, visit: www.cissoid.com/ or www.silicon-mobility.com/
integration of Silicon Mobility's OLEA FPCU controller with CISSOID's Silicon Carbide (SiC) Intelligent Power Module (IPM) platform. This new highly integrated platform is designed to accelerate the development of compact and efficient SiC Inverters for EV motor drives.
The partnership will deliver a SiC Inverter modular platform offering highly integrated hardware and optimized software: a power module and its gate driver with protections and fault management, an ultra-fast FPCU controller and its application software optimized for e-motor control. CISSOID's IPMs integrate a 3-Phase 1200V/340A-550A SiC MOSFET Power Module with a temperature-robust gate driver enabling low switching losses and high power density. Silicon Mobility's OLEA FPCU controller and OLEA APP INVERTER software are designed to enable fast and highly efficient electric motor control.
"Silicon Mobility ultra-fast OLEA FPCU is the perfect technology to control our SiC IPM platform in motor drive applications," says Pierre Delatte, CTO of CISSOID. "The capability of SiC power modules to switch faster and to operate at higher frequencies makes it essential to have access to a controller technology capable of running real-time algorithms faster. OLEA FPCU low power consumption is also a key advantage in building highly compact and efficient traction inverters".
The resulting SiC Inverter platform is planned to be made available for customers by early Q2-2022.
For more information, visit: www.cissoid.com/ or www.silicon-mobility.com/
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NOVEMBER 11 - 25th Annual Components for Military & Space Electronics Conference (CMSE)
CMSEApril 26-28, 2022 LIVE CONFERENCE
Check out the video below to see what CMSE is all about!
Dear Colleague,
We're back and planning a live event next year. Pricing and online registration details will be available soon at https://www.tjgreenllc.com/cmse/.
25th Annual Components for Military & Space Electronics Conference
CMSE
April 26-28, 2022
LIVE CONFERENCE
Four Points by Sheraton (LAX) Los Angeles, California
Deadline for Submission: January 15, 2022 Presentations are 15 minutes with 5 minutes of Q & A. The CMSE committee does not require a formal paper submission. You decide how much of the presentation material to provide the attendee. Remote virtual presentations will be considered for those who can’t travel. The idea is to promote sharing of basic scientific and technical information about common problems faced by both the component manufacturer and the system OEMs in the Aerospace industry.
Please email your presentation abstract to Amber: info@tjgreenllc.com. Be sure to include your contact details.
You are requested to submit a one page abstract on topics such as:
The Program:
Call us if you have questions at 610-625-2158.
Tom Green
CMSE Program Chair
Submit a PresentationTo learn more about virtual exhibiting at CMSE 2022 email Tom Terlizzi at terlizzi@tjgreenllc.com.
Our mailing address is:
TJ Green Associates, LLC
739 Redfern Lane
Bethlehem, Pennsylvania 18017
Add us to your address book
We're back and planning a live event next year. Pricing and online registration details will be available soon at https://www.tjgreenllc.com/cmse/.
25th Annual Components for Military & Space Electronics Conference
CMSE
April 26-28, 2022
LIVE CONFERENCE
Four Points by Sheraton (LAX) Los Angeles, California
Deadline for Submission: January 15, 2022 Presentations are 15 minutes with 5 minutes of Q & A. The CMSE committee does not require a formal paper submission. You decide how much of the presentation material to provide the attendee. Remote virtual presentations will be considered for those who can’t travel. The idea is to promote sharing of basic scientific and technical information about common problems faced by both the component manufacturer and the system OEMs in the Aerospace industry.
Please email your presentation abstract to Amber: info@tjgreenllc.com. Be sure to include your contact details.
You are requested to submit a one page abstract on topics such as:
- Alternate grade parts for use in harsh environments
- Non-hermetic COTS utilization and implementation
- Long term dormant storage (Hermetic vs. Non-Hermetic)
- EEE parts engineering issues for small sats
- Supercapacitors and high CV for high rel applications
- PME/BME MLCCs for hi-rel applications
- Tantalum polymer progression towards space and wear out issues
- GaN and SiC for RF and power management
- SIP 2.5- 3D and wafer level packaging WLP
- Continuity of the electronics supply chain
- Alternate approval for PMP for space
- Counterfeits, trust, and security issues in supply chain management
- Digital engineering/model-based design
- High temp electronics
The Program:
- Keynote talks by industry leaders and an Invited speakers
- Technical presentations by industry experts with Q&A
- Focused panel discussion on topics such as; use of automotive grade parts for mil and space
- Numerous exhibitors interacting live with attendees
- Cutting edge technical tutorials taught by industry experts
- Opportunities for students and young professionals planning a career in the military and aerospace industry
Call us if you have questions at 610-625-2158.
Tom Green
CMSE Program Chair
Submit a PresentationTo learn more about virtual exhibiting at CMSE 2022 email Tom Terlizzi at terlizzi@tjgreenllc.com.
Our mailing address is:
TJ Green Associates, LLC
739 Redfern Lane
Bethlehem, Pennsylvania 18017
Add us to your address book
NOVEMBER 4 - 25th Annual COMPONENTS FOR MILITARY AND SPACE ELECTRONICS (CMSE) SCHEDULED FOR LIVE SYMPOSIUM on APRIL 26-28, 2022 at LAX
CLick link below for
CMSE 2019 Video Promo from Thomas Green on Vimeo
Join us for the return to in-person meetings & great networking at the 25th Annual Components for Military & Space Electronics Conference April 26-28, 2022 LIVE CONFERENCE Four Points by Sheraton (LAX), Los Angeles, California
"CALL FOR PAPERS" FLYER CLICK HERE
CMSE 2019 Video Promo from Thomas Green on Vimeo
Join us for the return to in-person meetings & great networking at the 25th Annual Components for Military & Space Electronics Conference April 26-28, 2022 LIVE CONFERENCE Four Points by Sheraton (LAX), Los Angeles, California
"CALL FOR PAPERS" FLYER CLICK HERE
OCTOBER 20 - GM SYSTEMS EXHIBITS AT THE 35TH ANNUAL IEEE-MTT/APS MINI-SHOW
While hamperend with the pandemic and restrictions in New Jersey as far as vaccinated attendee and masking ,there still were approximately ~150 attendees and exhibitors plus several excellent presentations at the 35TH ANNUAL IEEE-MTT/APS MINI-SHOW in 2021.
For more photos by Bala Prasanna, who is now 2022 R1 Regional Director Elect (will take over in 2023), had kindly accepted Kirit Dixit, general event chairman, invitation to act as our unofficial Photographer of the event, check them on the link https://photos.app.goo.gl/jHv1f1Raop4Ah6qk8
For more photos by Bala Prasanna, who is now 2022 R1 Regional Director Elect (will take over in 2023), had kindly accepted Kirit Dixit, general event chairman, invitation to act as our unofficial Photographer of the event, check them on the link https://photos.app.goo.gl/jHv1f1Raop4Ah6qk8
OCTOBER 4 - CIRTEK ELECTRONICS HOLDINGS LAUNCHES NEW WEB SITE - FOR THREE BRANDS:
-CIRTEK ELECTRONICS CORPORATION
-CIRTEK ATS (Advanced Technology Solutions Inc.)
-QUINTEL SOLUTIONS
CLICK LINK FOR NEW CIRTEK WEB SITE
SEPTEMBER 30 - WJB SALES AND GM SYSTEMS UNITE TO
SUPPORT ES COMPONENTS FOR DIE AND PACKAGE HI-REL DEVICES AND SMT COMPONENTS
SEPTEMBER 20 - GM SYSTEMS TO EXHIBIT AT THE 35TH ANNUAL IEEE-MTT/APS MINI-SHOW
Thursday Oct. 7, 2021 IN NORTH NEW JERSEY
THE 35th ANNUAL SYMPOSIUM AND MINI-SHOW
DATE: THURSDAY OCTOBER 7, 2019.
PLACE: Hanover Manor, 16 Eagle Rock Avenue, E. Hanover, NJ 07936. Ph#973-992-7425
EXHIBIT AND PRESENTATIONS ARE FREE BUT YOU MUST REGISTER AT THIS LINK BELOW:
35th ANNUAL SYMPOSIUM AND MINI-SHOW : vTools Events (ieee.org)
YOU MUST BE VACCNATED AND WIRE A MASK DUE TO THE RULES OF NJ AT THE hANOVER MANOR
WITH ~>30 EXHIBITORS AND ~> 150 ATTENDEES THE CONFERENCE WEATHER.
THANKS
EASTERN INSTRUMENTS OF PHILADELPHIA (CLICK HER FOR EIP WEB SITE)
FOR SUPPORTING US
GM SYSTEMS WILL HIGHLIGHT THE FOLLOWING COMPANIES LISTED BELOW:
INTRODUCING OUR NEW PRODUCT LINE AUREL MICROELECTRONIC –
WIRELESS MODULES, THICK FILM HYBRIDS – ALUMINIUM NITRIDE- INSULATED METAL SUBSTRATES, SMT
AGILE MICROWAVE TECHNOLOGY- RF/MICROWAVE LNA & POWER AMPS AND MULTI-FUNCTION RF & MICROWAVE MODULES
TJ GREEN LLC-RF/MICROWAVE TRAINING FOR MICROELECTRONIC ASSEMBLY, CONSULTING, MIL-PRF-38534/MIL-STD-883, FAILURE ANALYSIS
DTA-SA-RF/MICROWAVE GROUND, AVIONIC AND SPACE COMPONENTS AND -U/C-D/C, CUSTOM FILTERS, SPLITTERS COMBINER, DIPLEXERS
CIRTEK-OFFSHORE RF AND MICROWAVE CHIP AND WIRE ASSEMBLIES AND MILLIMETER MODULES
ACT-BOX/SMT/HYBRID-CONTRACT MFG. ITAR
MICROCOAT–EPOXIES AND UV MATERIALS
ES COMPONENTS-DIE DISTRIBUTOR - VISHAY HIGH FREQUENCY & MIL-PRF-123 MLCC CAPS, THINFILM RESISTORS AND SUBSTRATES, Siliconix JFETS as die or in packaged form to MIL-PRF19500
MICROCHIP-WIRELESS PRODUCTS -DIE AND PACKAGED PARTS, (MICREL, ATM
DATE: THURSDAY OCTOBER 7, 2019.
PLACE: Hanover Manor, 16 Eagle Rock Avenue, E. Hanover, NJ 07936. Ph#973-992-7425
EXHIBIT AND PRESENTATIONS ARE FREE BUT YOU MUST REGISTER AT THIS LINK BELOW:
35th ANNUAL SYMPOSIUM AND MINI-SHOW : vTools Events (ieee.org)
YOU MUST BE VACCNATED AND WIRE A MASK DUE TO THE RULES OF NJ AT THE hANOVER MANOR
WITH ~>30 EXHIBITORS AND ~> 150 ATTENDEES THE CONFERENCE WEATHER.
THANKS
EASTERN INSTRUMENTS OF PHILADELPHIA (CLICK HER FOR EIP WEB SITE)
FOR SUPPORTING US
GM SYSTEMS WILL HIGHLIGHT THE FOLLOWING COMPANIES LISTED BELOW:
INTRODUCING OUR NEW PRODUCT LINE AUREL MICROELECTRONIC –
WIRELESS MODULES, THICK FILM HYBRIDS – ALUMINIUM NITRIDE- INSULATED METAL SUBSTRATES, SMT
AGILE MICROWAVE TECHNOLOGY- RF/MICROWAVE LNA & POWER AMPS AND MULTI-FUNCTION RF & MICROWAVE MODULES
TJ GREEN LLC-RF/MICROWAVE TRAINING FOR MICROELECTRONIC ASSEMBLY, CONSULTING, MIL-PRF-38534/MIL-STD-883, FAILURE ANALYSIS
DTA-SA-RF/MICROWAVE GROUND, AVIONIC AND SPACE COMPONENTS AND -U/C-D/C, CUSTOM FILTERS, SPLITTERS COMBINER, DIPLEXERS
CIRTEK-OFFSHORE RF AND MICROWAVE CHIP AND WIRE ASSEMBLIES AND MILLIMETER MODULES
ACT-BOX/SMT/HYBRID-CONTRACT MFG. ITAR
MICROCOAT–EPOXIES AND UV MATERIALS
ES COMPONENTS-DIE DISTRIBUTOR - VISHAY HIGH FREQUENCY & MIL-PRF-123 MLCC CAPS, THINFILM RESISTORS AND SUBSTRATES, Siliconix JFETS as die or in packaged form to MIL-PRF19500
MICROCHIP-WIRELESS PRODUCTS -DIE AND PACKAGED PARTS, (MICREL, ATM
CLICK IMAGE FOR LINK TO CISSOID SI-C WEB PAGE
FOR MORE INFORMATION ON CISSIOID SILICON CARBID SIC PRODUCTS PLEASE
CONTACT TOM TERLIZZI 516-807-9488 TERLIZZI@GMSYSTEMS.COM
CONTACT TOM TERLIZZI 516-807-9488 TERLIZZI@GMSYSTEMS.COM
SEPTEMBER 6 - DTA SA IN THE AMBITO NEWS
The United States and Argentina consolidate cooperation in the satellite industry
OPINIONS 10 September 2021
Argentina's participation in the Satellite fair, in Washington DC, allowed us to witness the role that companies such as Arsat, Invap, Veng and DTA, each with its expertise, can achieve in the United States market. In the satellite and space industry is experiencing a true effervescence. Topics that until a few years ago were reserved for Science Fiction, such as space tourism, microsatellites and constellations, today are among the very real and concrete business plans of specialized companies. Big global players like Space X, Virgin Galactic, Viasat or Amazon Space, compete and innovate to overcome some limits that seemed insurmountable.
According to the Satellite Industry Association, based in Washington, by 2029 the figure of 107,000 satellites in orbit could be reached , a feat that is exciting and at the same time disturbing due to the challenges of various kinds that it entails. Certain factors played a role in making the sector develop so quickly: the miniaturization of satellites, cost optimization and the growing participation of private companies - in an area formerly reserved for the military complex - are some of the main reasons for this boom. Argentina, which already has a prominent role in the international satellite industry, has a unique opportunity to consolidate and expand its contribution in the next decade. Our companies are valued, listened to and respected in this demanding and cutting-edge industry. Both large and small, both public and private. The effort of CONAE (National Commission for Space Activities), which turned 30 on May 28, is one of the causes of this prestige.
There is already a close binational cooperation that must be addressed: the two SAOCOM satellites were launched with vehicles from SpaceX, Elon Musk's company; and CONAE developed four satellites of the SAC series with NASA as the main partner . They are just two examples of a joint that is enriched and sustained over time.
Today we see that it is possible to go one step further in this society. Argentina's participation in the Satellite fair, in Washington DC, allowed us to witness the role that companies such as Arsat, Invap, Veng and DTA, each with its expertise, can achieve in the United States market. Satellite is one of the great global windows of the industry and Argentina was the Latin American country with the greatest presence. Our firms showed that our country is in a position to design and manufacture satellites, both for earth observation and communications.
Together with the Comptia Space Enterprise Council , we organized a business meeting at the Embassy that was attended by several of the most important companies in the world. To the aforementioned Space X, Virgin Galactic -whose owner, Richard Branson, traveled to space in a spacecraft of his company last July-, and Amazon, were joined by Lockheed Martin, Viasat, Ispace, the Swedish Space Corporation and various agencies of the State related to the regulation and promotion of the sector.
During the conference, it was reaffirmed that the United States needs to import diverse goods and services, with a high added value, and that Argentina is considered a valuable strategic partner . This opportunity is not just for large companies. In Argentina there are hundreds of SMEs with a qualified and punctual offer: from flight controllers to structural calculations, from small parts of satellites to software or propulsion systems. Entering the exclusive supplier base of the global giants of the satellite industry can change the reality of our SMEs, many of them founded with great effort by physicists and engineers, which could expand, hire more staff and firmly bet on their internationalization .
The benefits of this endeavor are manifold. High-quality employment is generated, value-added goods and services are exported, invested in training, and our specialists are valued. But, above all, it brings us closer to the ultimate goal established by our National Space Plan: to contribute to the technological development of Argentina.
OPINIONS 10 September 2021
Argentina's participation in the Satellite fair, in Washington DC, allowed us to witness the role that companies such as Arsat, Invap, Veng and DTA, each with its expertise, can achieve in the United States market. In the satellite and space industry is experiencing a true effervescence. Topics that until a few years ago were reserved for Science Fiction, such as space tourism, microsatellites and constellations, today are among the very real and concrete business plans of specialized companies. Big global players like Space X, Virgin Galactic, Viasat or Amazon Space, compete and innovate to overcome some limits that seemed insurmountable.
According to the Satellite Industry Association, based in Washington, by 2029 the figure of 107,000 satellites in orbit could be reached , a feat that is exciting and at the same time disturbing due to the challenges of various kinds that it entails. Certain factors played a role in making the sector develop so quickly: the miniaturization of satellites, cost optimization and the growing participation of private companies - in an area formerly reserved for the military complex - are some of the main reasons for this boom. Argentina, which already has a prominent role in the international satellite industry, has a unique opportunity to consolidate and expand its contribution in the next decade. Our companies are valued, listened to and respected in this demanding and cutting-edge industry. Both large and small, both public and private. The effort of CONAE (National Commission for Space Activities), which turned 30 on May 28, is one of the causes of this prestige.
There is already a close binational cooperation that must be addressed: the two SAOCOM satellites were launched with vehicles from SpaceX, Elon Musk's company; and CONAE developed four satellites of the SAC series with NASA as the main partner . They are just two examples of a joint that is enriched and sustained over time.
Today we see that it is possible to go one step further in this society. Argentina's participation in the Satellite fair, in Washington DC, allowed us to witness the role that companies such as Arsat, Invap, Veng and DTA, each with its expertise, can achieve in the United States market. Satellite is one of the great global windows of the industry and Argentina was the Latin American country with the greatest presence. Our firms showed that our country is in a position to design and manufacture satellites, both for earth observation and communications.
Together with the Comptia Space Enterprise Council , we organized a business meeting at the Embassy that was attended by several of the most important companies in the world. To the aforementioned Space X, Virgin Galactic -whose owner, Richard Branson, traveled to space in a spacecraft of his company last July-, and Amazon, were joined by Lockheed Martin, Viasat, Ispace, the Swedish Space Corporation and various agencies of the State related to the regulation and promotion of the sector.
During the conference, it was reaffirmed that the United States needs to import diverse goods and services, with a high added value, and that Argentina is considered a valuable strategic partner . This opportunity is not just for large companies. In Argentina there are hundreds of SMEs with a qualified and punctual offer: from flight controllers to structural calculations, from small parts of satellites to software or propulsion systems. Entering the exclusive supplier base of the global giants of the satellite industry can change the reality of our SMEs, many of them founded with great effort by physicists and engineers, which could expand, hire more staff and firmly bet on their internationalization .
The benefits of this endeavor are manifold. High-quality employment is generated, value-added goods and services are exported, invested in training, and our specialists are valued. But, above all, it brings us closer to the ultimate goal established by our National Space Plan: to contribute to the technological development of Argentina.
Ámbito Financiero is an Argentine newspaper founded on December 9, 1976 by economist Julio A. Ramos. It is one of the main economic newspapers. It was initially sold in Downtown Buenos Aires, covering mainly the daily prices of the U.S. dollar, gold, stocks, etc., and included other editorials
SEPTEMBER 8 - MICROCOAT TECHNOLOGIES UPDATE FOR OCTOBER IMAPS CONFERENCE
MicroCoat Technologies, a coatings, and adhesives development company was formed in 1996 by Sam Forman a veteran of over 60 years in polymer and thick film materials. He is a Founding and Charter Member, Fellow of the Society and Life Member of IMAPS, and also the recipient of the IMAPS Lifetime Achievement and Daniel C. Hughes awards.
The Company specializes in advanced conductive, non-conductive, and UV cure adhesives and coatings formulations for the electronics, microelectronics, and semiconductor industries that supply products to the Aerospace, Defense, Medical, Opto-electronics, Telecommunications, Down-hole, and also the commercial sector of assemblies. With over 150 combined years of polymer expertise, MicroCoat has developed unquestionably the finest fine-line no-bleed conductive adhesives and “sintered’ silver adhesives with a TC of >150W/mK. Our non-conductive sealing adhesives have passed MSL1 testing for many companies. The Company ships several thousand syringes each month of conductive and non-conductive die attach adhesives, globtop, dam, and fill formulations for semiconductor assemblies and MCM’s worldwide. MicroCoat’s “B” staged conductive and non-conductive films and liquids are used extensively for both die attach and package sealing.
Epoxy Ring Bleedout Issues Solved
With substrate real estate shrinking to “I can barely see it” dimensions, die placement very close to active wirebond areas was a major issue as pretty much all available adhesives had epoxy ring runout of as much 300-500um. Wirebonding down from a die or to a die with lines and wire placement as close as 250um is now pretty much standard. MicroCoat Technologies has developed their MiniDot technology with <50um bleed-out for conductive and non-conductive die-attach adhesives as the adhesives of choice for very small die, micro BGA’s, MCM, etc. placement/attachment.
Our library of over 3000 UV cure coatings is specifically formulated for the PCB Assembly/SMT, Medical, and Optoelectronics industries. MicroCoat UV cure or UV/Heat cure, globtops, dams, and fills are filled or unfilled. MicroCoat satisfies the most stringent of adhesives requirements.
Contact Information;
Sales - General: sales@m-coat.com
Purchasing – JenniferW@m-coat.com
Technical Sales; AddisonP@m-coat.com or KylieG@m-coat.com
Manufacturing; LoganB@m-coat.com
Quality; NoahD@m-coat.com
Marketing; VanessaJ@m-coat.com
Corporate;
David Martin – VP Operations; DavidM@m-coat.com
Liberta Trimboli - Finance Director; Liberta@m-coat.com
Sam Forman – President/CEO; Sam.Forman@m-coat.com
East Coast Manufacturers Sales Representative terlizzi@gmsystems.com
Servicing NY, NJ, PA located in Long Island, New York 516-807-9488
Take a look at the product sheet below ; for further information please contact me
The Company specializes in advanced conductive, non-conductive, and UV cure adhesives and coatings formulations for the electronics, microelectronics, and semiconductor industries that supply products to the Aerospace, Defense, Medical, Opto-electronics, Telecommunications, Down-hole, and also the commercial sector of assemblies. With over 150 combined years of polymer expertise, MicroCoat has developed unquestionably the finest fine-line no-bleed conductive adhesives and “sintered’ silver adhesives with a TC of >150W/mK. Our non-conductive sealing adhesives have passed MSL1 testing for many companies. The Company ships several thousand syringes each month of conductive and non-conductive die attach adhesives, globtop, dam, and fill formulations for semiconductor assemblies and MCM’s worldwide. MicroCoat’s “B” staged conductive and non-conductive films and liquids are used extensively for both die attach and package sealing.
Epoxy Ring Bleedout Issues Solved
With substrate real estate shrinking to “I can barely see it” dimensions, die placement very close to active wirebond areas was a major issue as pretty much all available adhesives had epoxy ring runout of as much 300-500um. Wirebonding down from a die or to a die with lines and wire placement as close as 250um is now pretty much standard. MicroCoat Technologies has developed their MiniDot technology with <50um bleed-out for conductive and non-conductive die-attach adhesives as the adhesives of choice for very small die, micro BGA’s, MCM, etc. placement/attachment.
Our library of over 3000 UV cure coatings is specifically formulated for the PCB Assembly/SMT, Medical, and Optoelectronics industries. MicroCoat UV cure or UV/Heat cure, globtops, dams, and fills are filled or unfilled. MicroCoat satisfies the most stringent of adhesives requirements.
Contact Information;
Sales - General: sales@m-coat.com
Purchasing – JenniferW@m-coat.com
Technical Sales; AddisonP@m-coat.com or KylieG@m-coat.com
Manufacturing; LoganB@m-coat.com
Quality; NoahD@m-coat.com
Marketing; VanessaJ@m-coat.com
Corporate;
David Martin – VP Operations; DavidM@m-coat.com
Liberta Trimboli - Finance Director; Liberta@m-coat.com
Sam Forman – President/CEO; Sam.Forman@m-coat.com
East Coast Manufacturers Sales Representative terlizzi@gmsystems.com
Servicing NY, NJ, PA located in Long Island, New York 516-807-9488
Take a look at the product sheet below ; for further information please contact me
| sell_sheet_042911.pdf |
THREE MOST POPOULAR MICROELECTRONICS ASDHESIVES AND EPOXIES FROM MICROCOAT TECHNOLOGIES
#1 MCT 36190-2GT(CLICK HERE FOR DATA SHEET)
Non-Conductive Die Attach Adhesive
A High Performance Single Component, Non Frozen Non-Conductive Epoxy
For SMD and Die Attach With an Operating Temperature Range of -65oC to +240oC
#2 MCT SD0802-31(CLICK HERE FOR DATA SHEET)A High Performance Single Component Conductive Epoxy for Inter-Connecting Silicon Stacked Die Layers & Forming Dots for Flipchips and BGA’s
#3 MCT 2-657/45(CLICK HERE FOR DATA SHEET) SINTERED SILVER FLEXIBLE CONDUCTIVE DIE ATTACH ADHESIVE WITH VERY FINE LINE CAPABILITIES
#1 MCT 36190-2GT(CLICK HERE FOR DATA SHEET)
Non-Conductive Die Attach Adhesive
A High Performance Single Component, Non Frozen Non-Conductive Epoxy
For SMD and Die Attach With an Operating Temperature Range of -65oC to +240oC
#2 MCT SD0802-31(CLICK HERE FOR DATA SHEET)A High Performance Single Component Conductive Epoxy for Inter-Connecting Silicon Stacked Die Layers & Forming Dots for Flipchips and BGA’s
#3 MCT 2-657/45(CLICK HERE FOR DATA SHEET) SINTERED SILVER FLEXIBLE CONDUCTIVE DIE ATTACH ADHESIVE WITH VERY FINE LINE CAPABILITIES
AUGUST 2 - ES Components is now evolving as a QPL SOURCE for Hirel Semiconductors
FOR MOR INFORMATION CONTACT TOM TERLIZI 516-807-9488 OR EMAIL TERLIZZI@GMSYSTEMS.COM
ES Components is evolving as a potential Vendor to YOU for Hirel Semiconductors, and we have initiated a new strategy to increase the benefit to YOU for hybrid and module based designs.
We know there have been issues with your current source for JAN/TX/V/S/R hermetic Diodes, Transistors and special assemblies. ES Components and VPT Components have teamed to offer the Best Alternative for hard-to-get Military/JAN Products. To mitigate these issues, ES Components has committed to placing a large stocking order for discrete 1N and 2N devices from VPT Components, fully qualified by DLA and listed on their QPL.
Below you’ll find a link to our website listing more than 16,800 QPL part numbers from VPT Components, as well as ES Components’ own hermetic Military products (JFETS, MOSFETS and Analog Switches acquired from Vishay Siliconix and qualified by ESC). As an added convenience, the QPL parts list includes links to DLA’s website, directly to the MIL-PRF-19500 and MIL-PRF-38535 slash sheets/SMDs for the devices in question. We can also provide special packaging in any configuration of these devices, such as duals, quads, or arrays based on your SCD, screened to MIL-PRF-19500 methods, or as specified in your SCDs.
The graph below, based on DLA’s data, ranks all QPL suppliers by their number of approved devices, demonstrating VPT Components’ portfolio strength as second only to Microsemi:
We would like to offer YOU the advantage of becoming part of our Stocking Program by including some of your hard-to-find components, with no obligation other than an opportunity to quote when the requirements arise. You will receive 24–48-hour delivery from stock and competitive pricing.
Please click VPTC and Siliconix Hermetic to be directed to the ESC webpages dedicated to these programs.
The listing of available QPL products is VPT Components QPL Devices
We welcome the opportunity to discuss this with you and/or your team at your convenience, and we would appreciate if you could identify the correct Supply Chain contact for these devices.
We’re committed to becoming the market’s first choice for JAN discrete devices, so please don’t hesitate to reach out with any questions or comments!
ES Components is evolving as a potential Vendor to YOU for Hirel Semiconductors, and we have initiated a new strategy to increase the benefit to YOU for hybrid and module based designs.
We know there have been issues with your current source for JAN/TX/V/S/R hermetic Diodes, Transistors and special assemblies. ES Components and VPT Components have teamed to offer the Best Alternative for hard-to-get Military/JAN Products. To mitigate these issues, ES Components has committed to placing a large stocking order for discrete 1N and 2N devices from VPT Components, fully qualified by DLA and listed on their QPL.
Below you’ll find a link to our website listing more than 16,800 QPL part numbers from VPT Components, as well as ES Components’ own hermetic Military products (JFETS, MOSFETS and Analog Switches acquired from Vishay Siliconix and qualified by ESC). As an added convenience, the QPL parts list includes links to DLA’s website, directly to the MIL-PRF-19500 and MIL-PRF-38535 slash sheets/SMDs for the devices in question. We can also provide special packaging in any configuration of these devices, such as duals, quads, or arrays based on your SCD, screened to MIL-PRF-19500 methods, or as specified in your SCDs.
The graph below, based on DLA’s data, ranks all QPL suppliers by their number of approved devices, demonstrating VPT Components’ portfolio strength as second only to Microsemi:
We would like to offer YOU the advantage of becoming part of our Stocking Program by including some of your hard-to-find components, with no obligation other than an opportunity to quote when the requirements arise. You will receive 24–48-hour delivery from stock and competitive pricing.
Please click VPTC and Siliconix Hermetic to be directed to the ESC webpages dedicated to these programs.
The listing of available QPL products is VPT Components QPL Devices
We welcome the opportunity to discuss this with you and/or your team at your convenience, and we would appreciate if you could identify the correct Supply Chain contact for these devices.
We’re committed to becoming the market’s first choice for JAN discrete devices, so please don’t hesitate to reach out with any questions or comments!
JULY 4 - CIRTEK EXPANDING AMID GLOBAL CHIP SHORTAGE (SEE PRESS RELEASE BELOW)
Published July 1, 2021, 3:59 PM MANILLA BUSINESS NEWS by James A. Loyola
Cirtek Holdings Philippines Corporation, through its semiconductor arm Cirtek Electronics Corporation (CEC), continues its collaboration with customers to develop expansion plans to address the global chip shortage that the industry is experiencingAs quoted from the Integrated Circuit (IC) Insight’s market research report, the worldwide IC market is expected to display an increase of 24 percent growth this year which will be driven by a 21 percent jump in shipments and a 2 percent increase in average selling price.
“This is very encouraging news for industries in the semiconductor space,” Cirtek said.
A growth rate of 24 percent would be the third largest increase in the global IC market over the past 16 years, being surpassed only by the 33 percent surge displayed in 2010 and the 25 percent increase registered in 2017, according to the IC Insights market research report.
Early in the first quarter of this year, CEC started procuring additional equipment to support the surge in demand from its customers. This is at the back of the Cirtek Group’s manufacturing capacity already running at 100 percent.
Cirtek Holdings Philippines Corporation, through its semiconductor arm Cirtek Electronics Corporation (CEC), continues its collaboration with customers to develop expansion plans to address the global chip shortage that the industry is experiencingAs quoted from the Integrated Circuit (IC) Insight’s market research report, the worldwide IC market is expected to display an increase of 24 percent growth this year which will be driven by a 21 percent jump in shipments and a 2 percent increase in average selling price.
“This is very encouraging news for industries in the semiconductor space,” Cirtek said.
A growth rate of 24 percent would be the third largest increase in the global IC market over the past 16 years, being surpassed only by the 33 percent surge displayed in 2010 and the 25 percent increase registered in 2017, according to the IC Insights market research report.
Early in the first quarter of this year, CEC started procuring additional equipment to support the surge in demand from its customers. This is at the back of the Cirtek Group’s manufacturing capacity already running at 100 percent.
JUNE 15 - SAM FORMAN, PRESIDENT MICROCOAT TECHNOLOGIES, RECEIVES LIFETIME ACHEIVEMNT AWARD FROM IMAPS
JUNE 6 - UPDATE POST COVID-19 NEWS ON MICROCOAT TECHNOLOGIES-COATINGS AND ADHESIVES
We did not want you to forget about us so I thought that I would remind you of just a few of the things that we do and who we are; MicroCoat Technologies, a coatings, and adhesives development company was formed in 1996 by Sam Forman a veteran of over 60 years in polymer and thick film materials. He is a Founding and Charter Member, Fellow of the Society and Life Member of IMAPS, and the recipient of the IMAPS Lifetime Achievement and Daniel C. Hughes awards.
The Company specializes in advanced conductive, non-conductive, and UV cure adhesives and coatings formulations for the electronics, microelectronics, and semiconductor industries that supply products to the Aerospace, Defense, Medical, Opto-electronics, Telecommunications, Down-hole, and the commercial sector of assemblies. With over 150 combined years of polymer expertise, MicroCoat has developed unquestionably the finest fine-line no-bleed conductive adhesives and “sintered’ silver adhesives with a TC of >150W/mK. Our non-conductive sealing adhesives have passed MSL1 testing for many companies. The Company ships several thousand syringes each month of conductive and non-conductive die attach adhesives, globtop, dam, and fill formulations for semiconductor assemblies and MCM’s worldwide. MicroCoat’s “B” staged conductive and non-conductive films and liquids are used extensively for both die attach and package sealing.
Epoxy Ring Bleedout Issues Solved
With substrate real estate shrinking to “I can barely see it” dimensions, die placement very close to active wirebond areas was a major issue as pretty much all available adhesives had epoxy ring runout of as much 300-500um. Wirebonding down from a die or to a die with lines and wire placement as close as 250um is now pretty much standard. MicroCoat Technologies has developed their MiniDot technology with <50um bleed-out for conductive and non-conductive die-attach adhesives as the adhesives of choice for very small die, micro BGA’s, MCM, etc. placement/attachment.
Our library of over 3000 UV cure coatings is specifically formulated for the PCB Assembly/SMT, Medical, and Optoelectronics industries. MicroCoat UV cure or UV/Heat cure, globtops, dams, and fills are filled or unfilled. MicroCoat satisfies the most stringent adhesives requirements.
Contact Information;
Sales-General: sales@m-coat.com
Purchasing – General Purchasing@mcoat.com
Technical Sales; AddisonP@m-coat.com KylieG@m-coat.com
Corporate; David Martin – VP Operations; DavidM@m-coat.com
Liberta Trimboli - Finance Director; Liberta@m-coat.com
Sam Forman – President/CEO; Sam.Forman@m-coat.com
The Company specializes in advanced conductive, non-conductive, and UV cure adhesives and coatings formulations for the electronics, microelectronics, and semiconductor industries that supply products to the Aerospace, Defense, Medical, Opto-electronics, Telecommunications, Down-hole, and the commercial sector of assemblies. With over 150 combined years of polymer expertise, MicroCoat has developed unquestionably the finest fine-line no-bleed conductive adhesives and “sintered’ silver adhesives with a TC of >150W/mK. Our non-conductive sealing adhesives have passed MSL1 testing for many companies. The Company ships several thousand syringes each month of conductive and non-conductive die attach adhesives, globtop, dam, and fill formulations for semiconductor assemblies and MCM’s worldwide. MicroCoat’s “B” staged conductive and non-conductive films and liquids are used extensively for both die attach and package sealing.
Epoxy Ring Bleedout Issues Solved
With substrate real estate shrinking to “I can barely see it” dimensions, die placement very close to active wirebond areas was a major issue as pretty much all available adhesives had epoxy ring runout of as much 300-500um. Wirebonding down from a die or to a die with lines and wire placement as close as 250um is now pretty much standard. MicroCoat Technologies has developed their MiniDot technology with <50um bleed-out for conductive and non-conductive die-attach adhesives as the adhesives of choice for very small die, micro BGA’s, MCM, etc. placement/attachment.
Our library of over 3000 UV cure coatings is specifically formulated for the PCB Assembly/SMT, Medical, and Optoelectronics industries. MicroCoat UV cure or UV/Heat cure, globtops, dams, and fills are filled or unfilled. MicroCoat satisfies the most stringent adhesives requirements.
Contact Information;
Sales-General: sales@m-coat.com
Purchasing – General Purchasing@mcoat.com
Technical Sales; AddisonP@m-coat.com KylieG@m-coat.com
Corporate; David Martin – VP Operations; DavidM@m-coat.com
Liberta Trimboli - Finance Director; Liberta@m-coat.com
Sam Forman – President/CEO; Sam.Forman@m-coat.com
MAY 5 - GM SYSTEMS ADDS SUPPORT STAFF TO EXPEDITE ELECTRONIC COMPONENT DELIVERIES DUE TO COVID-19
FOR MORE INFORMATION ON HOW WE CAN SUPPORT YOUR REQUIREMENTS IN NEW YORK STATE, METRO NYC AND NEW ENGLAND...PLEASE CALL OR EMAIL TOM TERLIZZI (516-807-9488) OR EMAIL TO: terlizzi@gmsystems.com
APRIL 15 - PPI LASER RESISTOR TRIMMER, PCB DRILLER, FLYING PROBE AND LASER SOLUTIONS EXHIBITS AT 24TH ANNUAL COMPONENTS FOR MILITARY AND SPACE ELECTRONICS (CMSE)
CLICK HERE FOR BROCHURES datasheet-rapitrim-c.pdf
AND CHECK OUR CMSE VIRTUAL EXHIBIT AT
www.tjgreenllc.com/cmse/2021-cmse-exhibitors/
SCROOL TO BOTTOM OF THE PAGER.........
AND CHECK OUR CMSE VIRTUAL EXHIBIT AT
www.tjgreenllc.com/cmse/2021-cmse-exhibitors/
SCROOL TO BOTTOM OF THE PAGER.........
APRIL 5 24TH ANNUAL COMPONENTS FOR MILITARY AND SPACE ELECTRONICS (CMSE) PRESS RELEASE
Media Contacts:
Thomas Green, CMSE Program Chairman TJ Green Associates
info@tjgreenllc.com
+1 610.625.2158
FOR IMMEDIATE RELEASE – February 22, 2021
Christina Sandidge
BtB Marketing Communications christina.sandidge@btbmarketing.com 919.872.8172
The 2021 Components for Military & Space Electronics (CMSE) Conference to be Presented Virtually
Thomas Green, CMSE Program Chairman TJ Green Associates
info@tjgreenllc.com
+1 610.625.2158
FOR IMMEDIATE RELEASE – February 22, 2021
Christina Sandidge
BtB Marketing Communications christina.sandidge@btbmarketing.com 919.872.8172
The 2021 Components for Military & Space Electronics (CMSE) Conference to be Presented Virtually
- The 24th annual CMSE conference will be held April 19 – 23, 2021
- All technical sessions will be presented in an online format
- Four tutorial sessions will be held preceding and following the conference program
BETHLEHEM, PA (February 22, 2021) – The 24th annual Components for Military & Space Electronics (CMSE) Conference will be held virtually April 19–23, 2021, due to concerns over the global coronavirus (COVID-19) pandemic. CMSE is the industry’s premier forum designed to present best practices for component and project engineers, quality assurance, and supply chain personnel engaged in military and space electronic systems. The full conference program, which includes more than 35 technical presentations delivered by leading industry experts from around the world, as well as three keynote addresses and two focused panel discussions, will be presented in an online format.
APRIL 1 - SIGNETICS DEVELOPS REVOLUTIONARY WRITE ONLY MEMORY FOR BITCOIN
MARCH 17 - AVX SUPPORTS 24TH ANNUAL CMSE VIRTUAL CONFERENCE AND EXHIBIT FOR TEENTH YEAR
For more information on AVX presentation and tutorials see this press release click here
For more information on CMSE presentations and tutorials click here
For more information on CMSE (Components for Military and Space Electronics) click here
For more information on CMSE presentations and tutorials click here
For more information on CMSE (Components for Military and Space Electronics) click here
MARCH 1 - ES COMPONENTS OFFERS CUSTOM PACKAGING & OBSOLESCENCE SUPPORT TO MILITARY STANDARDS
ES Components provides Manufacturing Services in addition to providing Off-the-Self Inventory. All testing is performed by labs certified by both DLA and ES Components.
Our services are extensive. We offer Custom Packaging using our legacy Inventory that includes over 40,000 components.
Our services are extensive. We offer Custom Packaging using our legacy Inventory that includes over 40,000 components.
FEBRUARY 17 - QPL JFETs and MOSFETs from ES COMPONENTS / VPT COMPONENTS
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FEBRUARY 3 - 24th Annual Components for Military & Space Electronics (CMSE) Virtual Conference April 19-23, 2021
CMSE premier event focused on the design, reliability, and application of electronic components for use in avionics, aerospace, military, and commercial space systems.
The Mission:
Deliver a low cost, virtual conference experience focused on high quality technical talks, keynotes and panel discussions that foster maximum attendee participation/interaction and furthers our collective understanding of the technical challenges faced in our industry. Showcase the supplier base to the greatest extend possible. Educate the industry, especially young component engineers, in order to secure the future defense of our country.
The Program:
- Keynote talks by industry leaders
- Over 35 technical presentations by industry experts with Q&A
- Focused panel discussion on topics such as; use of alternate grade parts for mil and space
- Vender presentations and virtual exhibits
- Cutting edge tutorials
JANUARY-12 - GM SYSTEMS OFFERS ONSITE SOURCE INSPECTION CSI, VENDOR SURVEILLANCE AND EXPEDITE
RESOURCES IN METRO-NYC, (N.Y.,N.J. CT.), UPSATE NY, AND NEW ENGLAND ...CLICK FOR MORE INFORMATION
CONTACT TOM TERLIZZI 516-807-9488
SUPPLIER surveillance for electronics, mechanical, semiconductor, integrated circuits, modules, PWB's systems, hybrid, rf & microwave
1-25-2021 MICROCOAT TECHNOLOGIES TO SPONSOR
DEVICE PACKAGING
