GM SYSTEMS LLC
CHECK THESE OUT....
  • HOME
  • SERVICES
    • MANAGEMENT >
      • STRATEGIC THINKING
      • LEAD, FOLLOW, OR GET OUT OF THE WAY----duc, sequere, aut de via decede
      • NEW BUSINESS DEVELOPMENT
      • TECHNOLOGY TRANSFER
      • PROGRAM MANAGEMENT 101
      • CONSULTING FEES
      • TOP CONSULTING COMPANIES (50)
      • FORTUNE 500 2014 PUBLIC COMPANIES
      • COMPETITIVE ADVANTAGE
      • STARTING A NEW BUSINESS 101
      • ROYALTY
    • SALES & MARKETING >
      • SALES REPRESENTATION 101
      • TOP TEN MARKETING MISTAKES
      • SALES & MARKETING 101
      • MAKING THE NUMBERS JACK FALVEY
      • MEDIA PARTNERS >
        • Jessica's advertising
        • JESSICA'S COMMERCIAL TV VIDEO'S
        • Robert Terlizzi Graphic Design
        • MULTI-MEDIA TECHNOLOGY-A full-service digital design agency.
        • META MEDIA
        • LOCAL MARKETING INC.
      • PACIFIC RIM ENGINEERING LLC
      • MiDAROME Electronics
    • ENGINEERING >
      • MICROELECTRONIC PACKAGING SEMINARS
      • PARTS, MATERIALS PROCESSES (PMP)
      • OOPS (OUT OF PRODUCTION SPARES)
      • RELIABILITY ENGINEERING
      • MiDAROME Electronics
      • MICROCOAT - MATERIALS AND PROCESS CONSULTING
      • MIL SPECs
      • DTA-SA >
        • ABOUT DTA-SA
        • DTA-SA S Band Transmitter BPSK / QPKS STX03
        • DTA-SA GROUND SUPPORT EQUIPMENT
      • ENGINEERING CONSULTING & FEES
      • AGILE MICROWAVE TECHNOLOGY-rf-and-microwave-components
    • MANUFACTURING >
      • JSI LOGISTICS
      • ADVANCED CIRCUIT TECHNOLOGY CONTRACT SMT/MEMS/HYBRID ASSEMBLY-MADE IN THE USA
      • CIRTEK ELECTRONICS -OFFSHORE-SEMICONDUCTOR & ELECTRONIC ASSEMBLY
      • MICRO PRINTING SYSTEMS-MPS screen printers & squeegee materials-for thick film and solder paste deposition
      • OOPS (OUT OF PRODUCTION SPARES)
  • PARTNERS
    • LIST OF PARTNERS
    • ASSEMBLY SERVICES SMT-HYBRID-IC >
      • ADVANCED CIRCUIT TECHNOLOGY - Contract SMT, HYBRID, COB, Box Assembly-Made in the USA
      • CIRTEK - Offshore Semiconductor/SMT Assembly
      • AUREL MICROELECTRONICS EMS/THICK FILM
    • EQUIPMENT SCREEN PRINTERS - UV CURING - DIE BOND TOOLS >
      • MPS-THICK FILM/SOLDER SCREEN PRINTERS
      • MICROCOAT - UV -CURING-DISPENSING
    • ICS,ASICs, DISCRETE SEMICONDUCTORS, RF COMPONENTS >
      • AGILE MICROWAVE TECHNOLOGY-RF & Microwave Components
      • AUREL MICROELECTRONICS-WIRELESS-RF PRODUCTS
      • NETSOL MEMORY CHIPS
      • CISSOID - High Temperature Integrated Circuits, Diodes, Transistors and FETS >
        • CISSOID - WEB SITE-High Temperature Integrated Circuits, Diodes, Transistors and FETS 2
      • MiDAROME Electronics
      • ES COMPONENTS DIE AND PASSIVES FOR HYBRIDS, COB, MCM'S AND PWB ASSEMBLIES >
        • ES COMPONENTS DIE AND PASSIVES FOR HYBRIDS, COB, MCM'S AND PWB ASSEMBLIES
      • SILICON LINK Power management IC's, and Discrete Semiconductors >
        • SILICON LINK CROSS REFERENCE
        • TVS
        • DISCRETES - HV TRANSISTORs & SCRs
        • LED DRIVERS
        • POWER MOSFETS
        • VOLTAGE REFERENCES
        • POWER SUPPLY IC'S
        • OPERATIONAL AMPLIFIERS
        • GREEN PWM IC's
        • COMPARATORS
        • VOLTAGE REGULATORS
        • LDO
        • CROSS REFERENCE and ASTEC SEMI-DATA SHEETS AND APP NOTES
    • MiDAROME Electronics
    • COMPUPOWER-MIL-STD-1553 Databus, transformers, couplers and Products
    • MICROCOAT - Polymer Adhesives & Coatings >
      • MICROCOAT SELECTOR GUIDES, PRESENTATION & OVERVIEW >
        • MICROCOAT PRESENTATION & OVERVIEW
        • SELECTOR GUIDE-INDUSTRIAL ADHESIVES
        • SELECTOR GUIDE ARMATURE BALANCING
        • SELECTOR GUIDE OPTICAL ADHESIVES
        • SELECTOR GUIDE CONDUCTIVE SILVER
        • SELECTOR GUIDE GLOB TOPS
        • SELECTOR GUIDE OPTICS AND GLASS BONDING
        • SELECTOR GUIDE MCT ANISOTROPIC THERMOSET & THERMOPALSATIC SYSTEMS
      • MICROCOAT UV PRESENTATION >
        • SELECTOR GUIDE UV CURE COATING AND ADHESIVES
      • MICROCOAT OPITAL ADHESIVE SELECTOR GUIDE
      • MICROCOAT 3D DISPENSING
      • MICROELECTRONIC ADHESIVES AND COATINGS
      • MEDICAL ADHESIVES
    • KOARTAN - Thick FIlm Materials >
      • ABOUT KOARTAN
      • KOARTAN SHORT LIST OF SOME OF THE THICK FILM PASTES
      • KOARTAN-THICK FILM PASTE PRODUCTS
      • KOARTAN - Powders and Fine Chemicals
      • KOARTAN - LIST OF ALL PRODUCTS
    • SOFTWARE-ALE System Integration-TEST, LAB, MANUFACTURING AND FINANCE
    • AGILE MICROWAVE CONTACTS
    • MICROCERTEC-Ceramic machining -3D Thin film metallising and laser micro-machining >
      • MICROCERTEC-3D PACKAGING -Thin film metallizing and laser micro-machining
      • MICROCERTEC-HIGH VACUUM CERAMIC, GLASS & FILAMENT ASSEMBLIES
      • PNL INNOTECH Provides Glass and Ceramic-to-Metal hermetic Seals
      • KERDY- Optical, Fiber Optic, and Custom thin film coatings
  • CMSE
  • ABOUT
    • ABOUT GM SYSTEMS
    • T2 BLOG
    • ADVERTISE
    • NEW PARTNERS
    • LINKEDIN
    • STEVE JOB'S QUOTE OF THE DAY >
      • HAPPY BIRTHDAY JOE AND TOM
      • CMSE >
        • 24th ANNUAL CMSE2021
        • 23rd ANNUAL CMSE(COMPONENTS FOR MILITARY AND SPACE ELECTRONICS)
        • 22nd-CMSE
  • CONTACT
    • CONTACT US
    • FEEDBACK
  • PRESS RELEASE
  • REFERENCE
    • GLOSSARY-ACRONYMS-LINKS >
      • BILL GRIEG'S MICROELECTRONIC GLOSSARY
    • ENGINEERING CALCULATORS AND TOOLS >
      • SWITCHING REG. CALCULATOR FOR MC 34063 or MC33063
      • PWB-TRACE-RESISTANCE
      • RESISTOR CALCULATOR (series and parallel)
      • PARALLEL PLATE CAP
      • THERMAL CONDUCTIVITY-TCE-DENSITY
      • ENGINEERING CONVERSIONS USING EXCEL
      • SCIENTIFIC CALCULATOR
    • HIGH TEMPERATURE SEMICONDUCTORS AND ELECTRONIC PACKAGING
    • FOURIER SERIES
    • OP-AMP QUIZ
    • RESISTORS
    • CURRENT SENSE RESISTORS
    • DIY......Do it yourself!
    • IMAPS-WORKSHOP AT THE COLLEGE NANOSCALE ENGINEERING
    • NAICS Codes
    • VOLTAGE REFERENCES TL431
    • EARLY-MICROELECTRONICS
    • CURRENCY
    • EE RESOURCES
    • JEDEC STANDARDS
preview
view in browser

CMSE Components for Military and Space Electronics Conf at LAX April 16-18.

The 23rd Annual Components for Military and Space Electronics is the premier event focused on new technology, advancements, design, reliability, and application of electronic components for use in avionics aerospace, military & commercial space systems.

When the Department of Defense first emphasized the use commercial components, they soon discovered that many of these components were not suitable for military and space systems without costly testing, uprating, up-screening, and protection from temperature extremes and radiation levels. Enter CMSE, which is the most comprehensive conference addressing successful practices for the use of both military and COTS components in military and space systems. Those individuals working in the field are encouraged to attend CMSE 2019 to stay ahead with the latest information and meet the exhibitors who can provide current equipment information and services.

The conference provides access to more than 30 technical presentations by industry leaders, focused on advanced packaging of ICs, passive components, and a number of other topics critical to components used in high reliability military and aerospace systems.

Click here to preview the Advance Program.

The cutting-edge tutorials, along with two days of exhibition and technical presentations, educate, inform, and provide solutions for current challenges within the military and space electronics business.

Keynote speakers for the event include:

  • Dennis Zogbi, Paumanok Publications, Inc.
    Called a "National Treasure" by the former undersecretary of defense, Zogbi is the founder and lead researcher at Paumanok Publications and the author of more than 300 studies on the global market for passive electronic components and related raw materials. Zogbi advises many of the largest hedge funds in the world in the area of mass produced and specialty electronic components and speaks on Wall Street on a monthly basis. Zogbi will be speaking on MLCC Shortages: FY 2019 Tier-To-Tier replacement Strategies and Alternative Reference Design Solutions.

  • Jonathan Ahlbin, MDA
    Dr. Jonathan Ahlbin is the Division Chief for Parts, Materials, and Processes Engineering (Acting) and the Branch Lead for EEE Parts Engineering with the U.S. Missile Defense Agency. In these roles, he is responsible for implementing and managing the team that oversees all MDA BMDS parts, materials, and process requirements and policies. Ahlbin will be speaking about Flexibility and Innovation in Military Systems.

Among the tutorial highlights is a day-long session on the reliability of passive components (capacitors, resistors, and inductors) taught by five of the leading experts in the field: Dr. Yuri Freeman, Kemet; John Marshall, AVX; Chris Reynolds, AVX; Scott Harris, Vanguard Electronics; and Bryan Yarborough, Vishay Dale Electronics.

For a complete rundown of all of this year's sessions at CMSE, click here.

Click to learn more about CMSE!
Copyright © *|CURRENT_YEAR|* TJ Green Associates, LLC, All rights reserved.

739 Redfern Lane
Bethlehem, PA 18017, USA


A veteran-owned small business.




Click here to unsubscribe.
You may unsubscribe at any time. Read our privacy policy.

Contact us by clicking here, emailing emailsolutions@pennwell.com, or writing:
PennWell Corporation
c/o E-mail Unsubscribe
1421 South Sheridan Road
Tulsa, OK 74112
USA
www.pennwell.com


Picture
Copyright © 1998, GM SYSTEMS LLC. All rights reserved. Web hosting by iPage
LEGAL NOTICE