"RF & MICROWAVE ELECTRONIC PACKAGING FOR MILITARY, AEROSPACE AND HIGH RELIABILITY APPLICATIONS" BY TOM TERLIZZI

INTRODUCTION
RF and Microwave circuit assembly, packaging and test require key attention to detail to achieve reliable operations in extreme military and aerospace environments. Design issues, component sourcing, substrate selection, process selections and material trade offs, are critical due to their high frequency characteristics. In addition new semiconductor device technology transitioning from commercial market (COTS) such as GaN on silicon substrates, GaN on Silicon Carbide (SiC), Silicon germanium (SiGe) and Indium Phosphide (InP) are now available for high reliability applications.. from TAP TIMES APRIL, 2020 EDITION
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