HOME-5-5-15

GM SYSTEMS LLC To Represent OMMIC -
MMIC FOUNDRY AND MMIC PRODUCTS in EASTERN U.S.
Ommic develops and produces advanced III-V semiconductor devices. The company offers InP, GaN, and GaAs based MMIC circuits, as well as foundry service and Epitaxial wafers based on III-V materials. It serves commercial, telecom, space, defense, base station, millimeter wave and wideband, and fiber optic interfacing markets throughout the world.

Click here for Press Release
Click here for Short Form Brochure
CLICK FOR NEW C-BAND CORE MMIC CHIP
CLICK HERE FOR X-BAND COMPONENTS
CLICK FOR 8-12 GHZ 12W 41dBm POWER AMP

GM SYSTEMS TO REPRESENT ES COMPONENTS IN
METROPOLITAN NYC, LONG ISLAND, UPSTATE NY. NEW JERSEY AND EASTERN PA.
CLICK HERE FOR A QUICK LOOK
SEE PRESS RELEASE

CLICK ON THE IMAGE FOR FOR INFORMATION

ES COMPONENTS Products & Services
VISHAY, SKYWORKS, VISHAY PRECISION GROUP, SEMICOA, ZETEX, GOWANDA, SENSITRON, MICREL, NOVACAP, ADVANCED SEMICONDUCTOR, INC. AND SKYWORKS-ISOLINK

ES Components is a bare die distributor supplying Military and Commercial grade Bare Die and Epoxy Mountable Passive components to the Hybrid and MCM markets.

Value Added Solutions Vendor Managed Inventory
Lot Acceptance Testing Ve ndor Managed Inventory (VMI)
Wafer Processing   Kan-Ban Programs
Detailed Lot Traceability   Consignment Programs
ASIC Solutions   Just In Time (JIT / Bonded Stock
Protective Inventory Storage Dock To Stock Programs
Kitting
contact Tom Terlizzi 631-269-3820 or Cell 516-807-9488

SILICON LINK - 2ND SOURCE
INTEGRATED CIRCUITS, DIODES, TRANSISTORS,
MOSFETS

click for larger image

SILICON LINK - POWER MANAGEMENT
INTEGRATED CIRCUITS

CROSS REFERENCE TO:
CHERRY SEMICONDUCTOR
HITACHI

RENESAS
NATIONAL SEMICONDUCTOR
SAMSUNG
UNITRODE
T.I. TEXAS INSTRUMENT
ON SEMICONDUCTOR
ST MICROELECTRONICS
LINEAR TECHNOLOGY

Y.L.S. Precision Industrial Limited, established in March 1996, is located in Chang'an Town, Dongguan City, Guangdong Province, which is famous for connectors, sensors, Insert Molding, automobile parts, computer peripheral connectors, precision mold design and manufacturing, and injection molding.

YLS PRECISION INDUSTRIAL LIMITED CHINA PARTNER

Y.L.S. PRECISION INDUSTRIAL LIMITED WAS ESTABLISHED IN 1996. WE ARE LOCATED IN CHANG'AN TOWN, DONGGUAN CITY, GUABGDONG PROVINCE WHICH IS FAMOUS FOR CONNECTORS,SENSORS INSERT MOLDING, AUTOMOBILE PARTS, COMPUTER PERIPHERAL CONNECTORS, PRECISION MOLD DESIGN AND MANUFACTURING AND INJECTION MOLDING.

The Existing plant covers an area of 9000 square meters, 400 employees serve the company with industry professionals capable of engineering your products and quality assurance teams to insure the highest quality standards. We have high-speed precision presses, grinding machines and imported testing, injection molding, mold processing equipment to meet your prototype and production quantities.

Y.L.S. company is the qualified supplier of TI, Sensata, Molex, FCI, Samtec, Teledyne, Amphenol, Foxlink, Taisol and so on. We are prepared to co-operate with our oversea customers and clients, and provide our best service to meet your demanding requirements.
see samples of our products (click here)
CLICK HERE FOR YLS WEB SITE
please contact Tom Terlizzi at GM Systems with your requirements

GM SYSTEMS LLC - L.I. N.Y.
631-269-3820 (LAND LINE)
516-807-9488 (CELL)

"FROM OLD TO NEW"

Advanced notice for the Next Microwave Packaging Technology Seminar in the New England area and East coast is at the IMAPS New England Chapter Symposium May 6-8, 2014.
We are looking for technical papers, contact Tom Green
Phone: 610-625-2158
Mobile: 610-730-3224
Email: info@tjgreenllc.com
Skype: thomas.j.green

- iMAPS New England Symposium Link
-Microwave Packaging Seminar link
Winter Webinar Week
Back by popular demand, it's Winter Webinar Week! From February 17th through February 20th, 2015, you will be able to watch one of our educational webinars each day. Simply choose the webinar(s) you'd like to attend, fill out the registration form, and tune in from the convenience of your own chair!
INTRODUCTION TO MICROELECTRONICS PACKAGING

February 17, 2015 (3 Sessions)
This is an easy-to-follow, overview webinar geared towards people unfamiliar with microelectronics packaging and all the confusing terminology, yet there is enough detail to give you a sense of what is important and what really drives the industry. As with all the webinars, there will be plenty of time for questions.
Course Outline Registration Form

CAN'T WAIT.. call to arrange an in-house training course tailored to your microelectronic, electrical design, maufacturing/process/quaity requirements or technology transfer project.
Contact us :
TJ Green Associates, LLC
Phone: 610-625-2158
Mobile: 610-730-3224
Email: info@tjgreenllc.com
Skype: thomas.j.green
Web Site: http://www.tjgreenllc.com/

MICROWAVE PACKAGING SEMINAR

Microwave Hybrids, MICs, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructors (Tom Green and Tom Terlizzi) share valuable lessons learned from years of experience in building Rf and Microwave hybrids, MMICs, and components. This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids.
See recent article by Tom Green and Tom Terlizzi in April's TAP Times

click on the photo to download the article

TOM GREEN (TJGREEN ASSOCIATES LLC) AND TOM TERLIZZI (AGILE MICROWAVE TECHNOLOGY, INC.) ARE FEATURED IN "TAP" TIMES " New Technology Challenges in Military/Space Microcircuits."
TAP TIMES is a digital magazine published by Ron Iscoff is editor and publisher. Ron has been involved with the semiconductor backend (assembly/packaging and test) for more than a quarter century. He was also the founding editor and publisher of Chip Scale Review, the leading magazine for the backend semiconductor fabrication. The mission of TAP TIMES is to keep our readers up-to-date on the latest news, technologies and products in device assembly, packaging and test.

TJ GREEN AND ASSOCIATES
Specific areas of expertise include:

Hermeticity and TM 1014 Spec update
Materials and processes for hybrid and microwave module assembly
Microelectronics packaging
Microwave packaging technology
Hermeticity and “near hermetic“ packaging
Visual inspection per MIL-STD-883
Wire bonding process development and failure analysis
Die bond processes including MMIC solder attach using AuSn
Failure analysis and root cause identification
Package design and material selection
Thick- and thin-film substrate fabrication
Advanced packaging
Hybrid process training
Expert witness cochlear implant failures
Class III medical implants
Military and aerospace microelectronic device applications
Reliability consultant

Our teaching and consulting services include:

Public Courses Range from one to four days, and cover a variety of topics, including wirebonding, visual inspection and defect recognition, hermeticity testing, process certification, microwave packaging technology, design for manufacturability and much more.

In-Plant Training Any of our technology courses can be tailored and customized to meet your training requirements and budgetary constraints. In-plant offerings include “hands-on” courses at the machines for operators and technicians.

Webinars Don’t have the time…then learn it on-line! A variety of live and archived webinars are available for your learning convenience.

Consulting Services cover everything from materials and process development, hermeticity evaluation, root cause FA investigations, technical writing and presentations to serving as an expert witness. We also provide Technology Transfer service and can help you find the right technology you require.